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1. (WO2017092075) ENVIRONMENTAL SENSOR AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/092075 International Application No.: PCT/CN2015/097317
Publication Date: 08.06.2017 International Filing Date: 14.12.2015
IPC:
G01D 5/241 (2006.01)
G PHYSICS
01
MEASURING; TESTING
D
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; TRANSFERRING OR TRANSDUCING ARRANGEMENTS NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
5
Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
12
using electric or magnetic means
14
influencing the magnitude of a current or voltage
24
by varying capacitance
241
by relative movement of capacitor electrodes
Applicants:
歌尔声学股份有限公司 GOERTEK.INC [CN/CN]; 中国山东省潍坊市 高新技术开发区东方路268号 268 Dongfang Road, Hi-Tech Industry District Weifang, Shandong 261031, CN
Inventors:
詹竣凯 ZHAN, Junkai; CN
蔡孟锦 CAI, Mengjin; CN
Agent:
北京博雅睿泉专利代理事务所(特殊普通合伙) BEYOND TALENT PATENT AGENT FIRM; 中国北京市 朝阳区朝阳门外大街10号昆泰大厦1202单元 Room 1202, Kuntai Building #10 Chaoyangmenwai Str., Chaoyang District Beijing 100020, CN
Priority Data:
201510890382.404.12.2015CN
Title (EN) ENVIRONMENTAL SENSOR AND MANUFACTURING METHOD THEREOF
(FR) CAPTEUR ENVIRONNEMENTAL ET SON PROCÉDÉ DE FABRICATION
(ZH) 一种环境传感器及其制造方法
Abstract:
(EN) An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate (1) comprising at least one recess (1a) disposed at an upper portion of the substrate (1); and a sensitive film layer (3) disposed above the substrate (1), comprising a fixed portion (3b) fixed on an end surface of the substrate (1) and a bent portion (3a) configured to extend inside the recess (1a). The bent portion (3a) and a side wall of the recess (1a) form a capacitor configured to detect a signal. The bent portion (3a), fixed portion (3b), and the recess (1a) form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.
(FR) L’invention concerne un capteur environnemental et son procédé de fabrication. Le capteur environnemental comprend : un substrat (1) comprenant au moins un évidement (1a) formé sur une partie supérieure du substrat (1) ; et une couche de film sensible (3) disposée au-dessus du substrat (1), comprenant une partie fixe (3b) fixée sur une surface d'extrémité du substrat (1) et une partie incurvée (3a) conçue pour s'étendre à l'intérieur de l'évidement (1a). La partie incurvée (3a) et une paroi latérale de l'évidement (1a) forment un condensateur conçu pour détecter un signal. La partie incurvée (3a), la partie fixe (3b), et l'évidement (1a) forment une cavité fermée. Une structure capacitive classique conçue sur une surface de substrat est changée en une structure capacitive du capteur environnemental s'étendant verticalement à l'intérieur du substrat, ce qui augmente une profondeur de l'évidement, et en retour, augmente une aire de détection entre deux plaques polaires du condensateur, ce qui réduit sensiblement une aire de couverture du condensateur sur le substrat, et satisfait à une exigence d'un composant électronique compact moderne.
(ZH) 一种环境传感器及其制造方法,包括基材(1),在所述基材(1)的上端设有至少一个凹槽(1a),还包括位于基材(1)上方的敏感膜层(3),所述敏感膜层(3)包括固定在基材(1)端面上的固定部(3b),以及伸入至凹槽(1a)内的弯曲部(3a),所述弯曲部(3a)与凹槽(1a)的侧壁构成了用于检测信号的电容器;其中,所述弯曲部(3a)、固定部(3b)与凹槽(1a)形成了密闭的容腔。该环境传感器,将传统设置在基材表面的电容器结构,改为垂直伸入基材内部的电容器结构,加大凹槽的深度即可增大电容器两个极板之间的感测面积,由此可大大缩小电容器在基材上的覆盖面积,满足了现代电子器件的轻薄化发展。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)
Also published as:
US20180356255