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1. (WO2017090898) SENSOR PACKAGE AND METHOD FOR PREPARING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090898 International Application No.: PCT/KR2016/012120
Publication Date: 01.06.2017 International Filing Date: 27.10.2016
IPC:
G06K 9/00 (2006.01) ,H01L 23/28 (2006.01) ,A61B 5/02 (2006.01) ,H01L 23/31 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9
Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
B
DIAGNOSIS; SURGERY; IDENTIFICATION
5
Measuring for diagnostic purposes; Identification of persons
02
Measuring pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography; Heart catheters for measuring blood pressure
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
(주)파트론 PARTRON CO., LTD. [KR/KR]; 경기도 화성시 삼성1로2길22 (석우동) (Seoku-dong) 22 Samsung 1-ro 2-gil Hwaseong-si Gyeonggi-do 18449, KR
Inventors:
이수길 LEE, Su Gil; KR
Agent:
최학현 CHOI, Hak Hyun; KR
Priority Data:
10-2015-016611326.11.2015KR
10-2015-016611526.11.2015KR
Title (EN) SENSOR PACKAGE AND METHOD FOR PREPARING SAME
(FR) BOÎTIER DE CAPTEUR ET PROCÉDÉ DE PRÉPARATION ASSOCIÉ
(KO) 센서 패키지 및 그 제조 방법
Abstract:
(EN) Disclosed is a method for preparing a sensor package. A method for preparing a sensor package, according to the present invention, comprises the steps of: preparing a sensor package comprising a base substrate, which has a signal pad formed on the upper side thereof and a hole passing through the upper side and lower side thereof, a sensor chip, which is positioned above the base substrate and has a signal terminal electrically connected to the signal pad, and an upper sealing portion which seals between the base substrate and the sensor chip so as to be airtight; testing the airtightness of the upper sealing portion by means of inserting air through the hole; and, if the airtightness test is passed, coupling a lower sealing portion, which seals the hole so as to be watertight, to the lower side of the base substrate.
(FR) L'invention concerne un procédé permettant de préparer un boîtier de capteur. L'invention concerne un procédé permettant de préparer un boîtier de capteur, ledit procédé consistant à : préparer un boîtier de capteur comprenant un substrat de base qui possède une pastille de signal formée du côté supérieur de celui-ci ainsi qu’un trou traversant le côté supérieur et le côté inférieur de celui-ci, une puce de capteur qui est positionnée au-dessus du substrat de base et comprend une borne de signal connectée électriquement à la pastille de signal, et une partie d'étanchéité supérieure qui assure l'étanchéité entre le substrat de base et la puce du capteur de façon à être étanche à l'air ; tester l'étanchéité à l'air de la partie d'étanchéité supérieure en insérant de l’air par le trou ; et, si le test d'étanchéité est réussi, coupler une partie d'étanchéité inférieure, qui assure l’étanchéité du trou de façon à être étanche à l'eau, à la face inférieure du substrat de base.
(KO) 센서 패키지의 제조 방법이 개시된다. 본 발명의 센서 패키지의 제조 방법은 상면에 신호 패드가 형성되고, 상면과 하면을 관통하는 홀이 형성된 베이스 기판, 상기 베이스 기판의 상부에 위치하고, 상기 신호 패드와 전기적으로 연결되는 신호 단자를 구비하는 센서 칩, 및 상기 베이스 기판과 센서 칩 사이를 기밀(氣密)하게 밀봉하는 상부 밀봉부을 포함하는 센서 패키지를 마련하는 단계, 상기 홀을 통과하도록 공기를 주입하여, 상기 상부 밀봉부의 기밀성을 테스트하는 단계 및 상기 기밀성 테스트가 통과되면, 상기 베이스 기판의 하면에 상기 홀을 수밀(水密)하게 밀봉하는 하부 밀봉부를 결합시키는 단계를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)