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1. (WO2017090890) EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090890 International Application No.: PCT/KR2016/011745
Publication Date: 01.06.2017 International Filing Date: 19.10.2016
IPC:
C08K 5/50 (2006.01) ,C08K 3/00 (2006.01) ,C08L 63/00 (2006.01) ,H01L 23/28 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
50
Phosphorus bound to carbon only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
Applicants:
삼성에스디아이 주식회사 SAMSUNG SDI CO., LTD. [KR/KR]; 경기도 용인시 기흥구 공세로 150-20 150-20, Gongse-ro, Giheung-gu Yongin-si Gyeonggi-do 17084, KR
Inventors:
한승 HAN, Seung; KR
정주영 CHUNG, Joo Young; KR
김민겸 KIM, Min Gyum; KR
Agent:
특허법인 아주 AJU INT'L LAW & PATENT GROUP; 서울시 서초구 사임당로 174, 강남미래타워 12-13층 12-13th Floor, Gangnam Mirae Tower, 174 Saimdang- Ro Seocho-Gu Seoul 06627, KR
Priority Data:
10-2015-016679226.11.2015KR
Title (EN) EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE SEALED USING SAME
(FR) COMPOSITION DE RÉSINE ÉPOXYDE POUR COLMATER UN DISPOSITIF À SEMI-CONDUCTEURS ET DISPOSITIF À SEMI-CONDUCTEURS COLMATÉ À L'AIDE DE CETTE DERNIÈRE
(KO) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
Abstract:
(EN) The present invention relates to an epoxy resin composition for sealing a semiconductor device, the composition containing an epoxy resin, a curing agent, an inorganic filler, and a flame retardant represented by chemical formula 1, and to a semiconductor device sealed by the same. In chemical formula 1, R is hydrogen or a C1-C20 hydrocarbon group.
(FR) La présente invention concerne une composition de résine époxyde pour colmater un dispositif à semi-conducteurs, la composition contenant une résine époxyde, un agent de durcissement, une charge inorganique et un retardateur de flamme représenté par la formule chimique 1, et un dispositif à semi-conducteurs colmaté à l'aide de celle-ci. Dans la formule chimique, R représente un groupe hydrogène ou un groupe hydrocarbure en C1-C20.
(KO) 본 발명은 에폭시 수지, 경화제, 무기 충전재 및 화학식 1로 표시되는 난연재를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이에 의해 밀봉된 반도체 소자에 관한 것이다. 상기 화학식 1에서, R은 수소 또는 탄소수 1~20의 탄화수소기이다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108291052