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1. (WO2017090875) ANISOTROPIC CONDUCTIVE FILM, AND CONNECTION STRUCTURE USING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090875 International Application No.: PCT/KR2016/010651
Publication Date: 01.06.2017 International Filing Date: 23.09.2016
IPC:
C09J 7/00 (2006.01) ,C09J 11/04 (2006.01) ,C09J 9/02 (2006.01) ,H01B 1/20 (2006.01) ,C09J 163/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants:
삼성에스디아이 주식회사 SAMSUNG SDI CO., LTD. [KR/KR]; 경기도 용인시 기흥구 공세로 150-20 150-20, Gongse-ro, Giheung-gu Yongin-si Gyeonggi-do 17084, KR
Inventors:
서현주 SEO, Hyun Joo; KR
권순영 KWON, Soon Young; KR
김하나 KIM, Ha Na; KR
고연조 KO, Youn Jo; KR
송기태 SONG, Ki Tae; KR
Agent:
특허법인 아주 AJU INT'L LAW & PATENT GROUP; 서울시 서초구 사임당로 174, 강남미래타워 12-13층 12-13th Floor, Gangnam Mirae Tower, 174 Saimdang- Ro Seocho-Gu Seoul 06627, KR
Priority Data:
10-2015-016636126.11.2015KR
Title (EN) ANISOTROPIC CONDUCTIVE FILM, AND CONNECTION STRUCTURE USING SAME
(FR) FILM CONDUCTEUR ANISOTROPE ET STRUCTURE DE CONNEXION LE METTANT EN ŒUVRE
(KO) 이방 도전성 필름 및 이를 이용한 접속 구조체
Abstract:
(EN) The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having different diameters, and an increase rate in diffusion length, represented by the following formula 1, of the insulation layer is greater than that of the conductive layer when measured after preliminarily compressing the film under a condition of 50-80°C, for 1-3 seconds and at 1.0-3.0 MPa and mainly compressing the same under a condition of 120-160°C, for 3-6 seconds and at a pressure of 60-90 MPa, and the storage modulus is 2.5-5 GPa when cured at a cure rate of 90% or more. Additionally, there is an advantage of enabling insulation and connection reliability to be improved by increasing the dispersibility of conductive particles. [Formula 1] Increase rate in diffusion length (%) = [(Transverse length of the corresponding layer after main compression - Transverse length of the corresponding layer before preliminary compression) / Transverse length of the corresponding layer before preliminary compression] ×100
(FR) La présente invention concerne un film conducteur anisotrope comprenant une couche conductrice et une couche isolante, la couche conductrice et la couche isolante comprenant chacune deux types de charges inorganiques présentant des diamètres différents, et un taux d'augmentation de longueur de diffusion, représenté par la formule suivante 1, de la couche isolante est supérieure à celui de la couche conductrice, mesuré après avoir préalablement comprimé le film dans des conditions de 50 à 80 °C, pendant 1 à 3 secondes et de 1,0 à 3,0 MPa et essentiellement en compressant ledit film dans des conditions de 120 à 160 °C, pendant 3 à 6 secondes et de pression de 60 à 90 MPa, et le module de stockage étant de 2,5 à 5 GPa lorsque durci à une vitesse de durcissement supérieure ou égale à 90 %. De plus, il présente l’avantage de permettant une fiabilité d’isolation et de connexion améliorée en augmentant la dispersibilité des particules conductrices. [Formule 1] Taux d'augmentation de longueur de diffusion (%) = [(longueur transversale de la couche correspondante après compression principale - longueur transversale de la couche correspondante avant la compression préliminaire) / longueur transversale de la couche correspondante avant la compression préliminaire] × 100
(KO) 본 발명은 도전층 및 절연층을 포함하고, 상기 도전층 및 절연층 각각은 입경이 상이한 2종의 무기 필러를 포함하는 이방 도전성 필름으로, 상기 필름을 50℃ 내지 80℃, 1 내지 3초간 및 1.0MPa 내지 3.0MPa의 조건에서 가압착하고, 120℃ 내지 160℃, 3 내지 6초간 및 60MPa 내지 90MPa의 압력 조건 하에서 본압착한 후 측정한 하기의 식 1로 나타나는 퍼짐 길이의 증가율이 절연층 > 도전층이고, 경화율 90% 이상으로 경화 시 저장 탄성률이 2.5 내지 5 GPa 인, 이방 도전성 필름에 관한 것으로, 도전 입자의 분산성을 높여 절연성 및 접속 신뢰성을 개선할 수 있는 이점이 있다. [식 1] 퍼짐 길이의 증가율 (%) = [(본압착 후 해당 층의 폭방향 길이 - 가압착 전 해당 층의 폭방향 길이) / 가압착 전 해당 층의 폭방향 길이] ×100
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108291121