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1. (WO2017090759) THERMOSETTING COMPOSITION AND CONDUCTIVE ADHESIVE USING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090759 International Application No.: PCT/JP2016/085071
Publication Date: 01.06.2017 International Filing Date: 25.11.2016
IPC:
C08F 2/44 (2006.01) ,C08F 4/34 (2006.01) ,C08F 290/06 (2006.01) ,C09J 4/02 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 11/06 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2
Processes of polymerisation
44
Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
4
Polymerisation catalysts
28
Oxygen or compounds releasing free oxygen
32
Organic compounds
34
Per-compounds with one peroxy-radical
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290
Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02
on to polymers modified by introduction of unsaturated end groups
06
Polymers provided for in subclass C08G52
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
02
Acrylmonomers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
Applicants:
株式会社スリーボンド THREE BOND CO., LTD. [JP/JP]; 東京都八王子市南大沢四丁目3番地3 4-3-3 Minamiosawa, Hachioji-shi, Tokyo 1920398, JP
Inventors:
太田 総一 OTA, Soichi; JP
真舩 仁志 MAFUNE, Hitoshi; JP
加藤 誠 KATO, Makoto; JP
小玉 智也 KODAMA, Tomoya; JP
長田 誠之 OSADA, Masayuki; JP
Agent:
八田国際特許業務法人 HATTA & ASSOCIATES; 東京都千代田区二番町11番地9 ダイアパレス二番町 Dia Palace Nibancho, 11-9, Nibancho, Chiyoda-ku, Tokyo 1020084, JP
Priority Data:
2015-23061026.11.2015JP
Title (EN) THERMOSETTING COMPOSITION AND CONDUCTIVE ADHESIVE USING SAME
(FR) COMPOSITION THERMODURCISSABLE ET ADHÉSIF CONDUCTEUR L'UTILISANT
(JA) 熱硬化性組成物およびそれを用いた導電性接着剤
Abstract:
(EN) [Problem] To provide a thermosetting composition which, when being cured quickly at a high temperature (within one minute at 100-150°C), can achieve the ability to avoid sudden boiling, and the ability of fast curing ability. [Solution] This thermosetting composition contains components (A)-(C), wherein component (A) is a compound having a (meth)acrylic group, component (B) is a phenolic compound that has a molecular weight of 230 or more and is soluble in component (A), and component (C) is an organic peroxide having a specific structure.
(FR) L'invention vise à fournir une composition thermodurcissable qui, lorsqu'elle est durcie rapidement à une température élevée (en une minute à 100 à 150 °C), a la capacité d'éviter l'ébullition soudaine, et la capacité de durcissement rapide. La composition thermodurcissable de la présente invention contient les composants (A)- (C), le composant (A) étant un composé ayant un groupe (méth)acrylique, le composant (B) étant un composé phénolique qui a un poids moléculaire de 230 ou plus et étant soluble dans le composant (A) et le composant (C) étant un peroxyde organique ayant une structure spécifique.
(JA) 【課題】従来は、高温短時間(100~150℃で1分以内)における硬化において、突沸すること無く速硬化性を両立できる熱硬化性組成物を提供する。 【解決手段】 (A)~(C)成分を含む熱硬化性組成物。 (A)成分:(メタ)アクリル基を有する化合物 (B)成分:分子量が230以上であって、且つ(A)成分に溶解するフェノール化合物 (C)成分:特定の構造の有機過酸化物
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108350105KR1020180087247