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1. (WO2017090439) RESIN SHEET FOR CONNECTING CIRCUIT MEMBERS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090439 International Application No.: PCT/JP2016/083334
Publication Date: 01.06.2017 International Filing Date: 10.11.2016
IPC:
H01L 21/60 (2006.01) ,C09J 7/00 (2006.01) ,C09J 159/00 (2006.01) ,C09J 167/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
159
Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
167
Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
土谷 和寛 TSUCHIYA Kazuhiro; JP
杉野 貴志 SUGINO Takashi; JP
根津 裕介 NEZU Yusuke; JP
Agent:
早川 裕司 HAYAKAWA Yuzi; JP
村雨 圭介 MURASAME Keisuke; JP
Priority Data:
2015-22921024.11.2015JP
Title (EN) RESIN SHEET FOR CONNECTING CIRCUIT MEMBERS
(FR) FEUILLE DE RÉSINE POUR CONNEXION D'ÉLÉMENTS DE CIRCUIT
(JA) 回路部材接続用樹脂シート
Abstract:
(EN) Provided is a resin sheet for connecting circuit members, said sheet being interposed between opposing electrodes and used to electrically connect the opposing electrodes. The resin sheet for connecting circuit members is characterized in that the material constituting the resin sheet has a melt viscosity of 1.0×100-5.0×105 Pa・s at 90 ºC before curing, and has, in the form of a cured article, an average linear expansion coefficient of 45 ppm or less at 0-130 ºC. Such a resin sheet for connecting circuit members is not susceptible to changes in the connection resistance at connection sections when circuit members are connected with each other, and thus, a high reliability is achieved.
(FR) L'invention concerne une feuille de résine pour connexion d'éléments de circuit, ladite feuille étant intercalée entre des électrodes opposées et utilisée pour connecter électriquement les électrodes opposées. La feuille de résine pour connexion d'éléments de circuit est caractérisée en ce que le matériau constituant la feuille de résine présente une viscosité à l'état fondu de 1,0 × 100 à 5,0 × 105 Pa・s à 90 °C avant durcissement, et présente, sous la forme d'un article durci, un coefficient de dilatation linéaire moyen inférieur ou égal à 45 ppm entre 0 et 130 °C. Une telle feuille de résine pour connexion d'éléments de circuit n'est pas susceptible d'entraîner des variations de la résistance de connexion au niveau de sections de connexion quand des éléments de circuit sont connectés l'un à l'autre, et par conséquent, une haute fiabilité est obtenue.
(JA) 相対向する電極間に介在され、相対向する電極を電気的に接続するために用いられる回路部材接続用樹脂シートであって、樹脂シートを構成する材料は、硬化前における90℃での溶融粘度が1.0×10~5.0×10Pa・sであり、硬化物の0~130℃における平均線膨張係数が45ppm以下であることを特徴とする回路部材接続用樹脂シート。かかる回路部材接続用樹脂シートによれば、回路部材同士を接続したときに、接続部での接続抵抗が変化し難く、高い信頼性を有するものとなる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108283002KR1020180084056