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1. (WO2017090422) CERAMIC/ALUMINUM JOINT BODY, INSULATED CIRCUIT BOARD, POWER MODULE, LED MODULE, AND THERMOELECTRIC MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090422 International Application No.: PCT/JP2016/083097
Publication Date: 01.06.2017 International Filing Date: 08.11.2016
IPC:
H01L 23/13 (2006.01) ,C04B 37/02 (2006.01) ,H01L 23/12 (2006.01) ,H01L 23/373 (2006.01) ,H01L 23/40 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
37
Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02
with metallic articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
Applicants:
三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP/JP]; 東京都千代田区大手町一丁目3番2号 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117, JP
Inventors:
寺▲崎▼ 伸幸 TERASAKI Nobuyuki; JP
長友 義幸 NAGATOMO Yoshiyuki; JP
Agent:
志賀 正武 SHIGA Masatake; JP
寺本 光生 TERAMOTO Mitsuo; JP
松沼 泰史 MATSUNUMA Yasushi; JP
細川 文広 HOSOKAWA Fumihiro; JP
大浪 一徳 ONAMI Kazunori; JP
Priority Data:
2015-23104026.11.2015JP
2016-17853013.09.2016JP
Title (EN) CERAMIC/ALUMINUM JOINT BODY, INSULATED CIRCUIT BOARD, POWER MODULE, LED MODULE, AND THERMOELECTRIC MODULE
(FR) CORPS ASSEMBLÉ CÉRAMIQUE/ALUMINIUM, CARTE DE CIRCUIT IMPRIMÉ ISOLÉ, MODULE DE PUISSANCE, MODULE DEL ET MODULE THERMOÉLECTRIQUE
(JA) セラミックス/アルミニウム接合体、絶縁回路基板、パワーモジュール、LEDモジュール、熱電モジュール
Abstract:
(EN) The joint body according to the present invention pertains to a ceramic/aluminum joint body in which a ceramic member and an aluminum member comprising aluminum or an aluminum alloy are joined together. The ceramic member is configured by a silicon nitride that includes magnesium, and at a jointing interface of the ceramic member and the aluminum member, a jointing layer is formed in which magnesium is included in compounds of aluminum, silicon, oxygen, and nitride.
(FR) La présente invention concerne un corps assemblé qui est un corps assemblé céramique/aluminium dans lequel un élément en céramique et un élément en aluminium comprenant de l'aluminium ou un alliage d'aluminium sont assemblés. L'élément en céramique est constitué par un nitrure de silicium qui contient du magnésium, et au niveau d'une interface d'assemblage de l'élément en céramique et l'élément en aluminium, une couche d'assemblage est formée dans laquelle du magnésium est contenu dans des composés d'aluminium, de silicium, d'oxygène et de nitrure.
(JA) 本発明の接合体は、セラミックス部材と、アルミニウム又はアルミニウム合金からなるアルミニウム部材とが接合されてなるセラミックス/アルミニウム接合体であって、前記セラミックス部材は、マグネシウムを含む窒化ケイ素で構成されており、前記セラミックス部材と前記アルミニウム部材との接合界面には、アルミニウム、ケイ素、酸素、および窒素の化合物にマグネシウムが含まれた接合層が形成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108292632KR1020180077204EP3382752US20180346387