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1. (WO2017090394) JOINING STRUCTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090394 International Application No.: PCT/JP2016/082522
Publication Date: 01.06.2017 International Filing Date: 02.11.2016
IPC:
B32B 27/00 (2006.01) ,B29C 65/16 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/08 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
16
Laser beam
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
06
as the main or only constituent of a layer next to another layer of a specific substance
08
of synthetic resin of a different kind
Applicants:
オムロン株式会社 OMRON CORPORATION [JP/JP]; 京都府京都市下京区塩小路通堀川東入南不動堂町801番地 801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogyo-ku, Kyoto-shi, Kyoto 6008530, JP
Inventors:
佐藤 大輔 SATO Daisuke; JP
西川 和義 NISHIKAWA Kazuyoshi; JP
Agent:
特許業務法人あーく特許事務所 ARC PATENT ATTORNEYS' OFFICE; 大阪府大阪市北区曽根崎1丁目1番2号 1-2, Sonezaki 1-chome, Kita-ku, Osaka-shi, Osaka 5300057, JP
Priority Data:
2015-23044226.11.2015JP
Title (EN) JOINING STRUCTURE
(FR) STRUCTURE D'ASSEMBLAGE
(JA) 接合構造体
Abstract:
(EN) Provided is a joining structure that is composed of a laser-transmitting resin member and a laser-absorbing resin member. The laser-absorbing resin member includes a first resin component, which is not compatible with the laser-transmitting resin member, and a second resin component, which is compatible with the laser-transmitting resin member. The abundance ratio of the second resin component in a melted/solidified part that constitutes the joining portion of the laser-transmitting resin member and the laser-absorbing resin member is higher than the abundance ratio of the second resin component in the laser-absorbing resin member.
(FR) L'invention concerne une structure d'assemblage qui est composée d'un élément en résine à transmission laser et d'un élément en résine à absorption laser. L'élément en résine à absorption laser comprend un premier composant de résine, qui n'est pas compatible avec l'élément en résine à transmission laser, et un second composant de résine qui est compatible avec l'élément en résine à transmission laser. Le rapport d'abondance du deuxième composant de résine dans une partie fondue/solidifiée qui constitue la partie d'assemblage de l'élément en résine à transmission laser et de l'élément en résine à absorption laser est supérieur au rapport d'abondance du deuxième composant en résine dans l'élément en résine à absorption laser.
(JA) レーザ透過性樹脂部材とレーザ吸収性樹脂部材とで構成される接合構造体である。レーザ吸収性樹脂部材は、レーザ透過性樹脂部材と相溶性を有しない第1樹脂成分と、レーザ透過性樹脂部材と相溶性を有する第2樹脂成分と、を含んでいる。レーザ透過性樹脂部材とレーザ吸収性樹脂部材との接合部を構成する溶融凝固部における第2樹脂成分の存在比率が、レーザ吸収性樹脂部材における第2樹脂成分の存在比率よりも高い。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN107848276EP3381682