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1. (WO2017090393) JOINING STRUCTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090393 International Application No.: PCT/JP2016/082521
Publication Date: 01.06.2017 International Filing Date: 02.11.2016
IPC:
B29C 65/16 (2006.01) ,B23K 26/18 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
16
Laser beam
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
18
using absorbing layers on the material being worked, e.g. for marking or protecting purposes
Applicants:
オムロン株式会社 OMRON CORPORATION [JP/JP]; 京都府京都市下京区塩小路通堀川東入南不動堂町801番地 801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogyo-ku, Kyoto-shi, Kyoto 6008530, JP
Inventors:
佐藤 大輔 SATO Daisuke; JP
西川 和義 NISHIKAWA Kazuyoshi; JP
Agent:
特許業務法人あーく特許事務所 ARC PATENT ATTORNEYS' OFFICE; 大阪府大阪市北区曽根崎1丁目1番2号 1-2, Sonezaki 1-chome, Kita-ku, Osaka-shi, Osaka 5300057, JP
Priority Data:
2015-23045926.11.2015JP
Title (EN) JOINING STRUCTURE
(FR) STRUCTURE D'ASSEMBLAGE
(JA) 接合構造体
Abstract:
(EN) Provided is a joining structure that is composed of a laser-transmitting resin member and a laser-absorbing resin member. The laser-absorbing resin member is a polymer alloy that includes a second resin component being compatible with the laser-transmitting resin member and has a co-continuous structure.
(FR) L'invention concerne une structure d’assemblage qui est composée d'un élément en résine de transmission laser et d’un élément en résine d'absorption laser. L'élément en résine d'absorption laser est un alliage polymère qui comprend un deuxième composant de résine étant compatible avec l’élément en résine de transmission laser et présente une structure co-continue.
(JA) レーザ透過性樹脂部材とレーザ吸収性樹脂部材とで構成される接合構造体である。レーザ吸収性樹脂部材は、レーザ透過性樹脂部材と相溶性を有する第2樹脂成分を含む、共連続構造を有するポリマーアロイである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)