Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017090392) METHOD FOR MANUFACTURING BONDED STRUCTURE AND BONDED STRUCTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090392 International Application No.: PCT/JP2016/082520
Publication Date: 01.06.2017 International Filing Date: 02.11.2016
IPC:
B29C 65/16 (2006.01) ,B23K 26/324 (2014.01) ,B23K 26/382 (2014.01) ,B23K 26/57 (2014.01) ,B29C 65/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
14
using wave energy or particle radiation
16
Laser beam
[IPC code unknown for B23K 26/324][IPC code unknown for B23K 26/382][IPC code unknown for B23K 26/57]
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65
Joining of preformed parts; Apparatus therefor
02
by heating, with or without pressure
Applicants:
オムロン株式会社 OMRON CORPORATION [JP/JP]; 京都府京都市下京区塩小路通堀川東入南不動堂町801番地 801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogyo-ku, Kyoto-shi, Kyoto 6008530, JP
Inventors:
神岡 渉 KAMIOKA Wataru; JP
西川 和義 NISHIKAWA Kazuyoshi; JP
Agent:
特許業務法人あーく特許事務所 ARC PATENT ATTORNEYS' OFFICE; 大阪府大阪市北区曽根崎1丁目1番2号 1-2, Sonezaki 1-chome, Kita-ku, Osaka-shi, Osaka 5300057, JP
Priority Data:
2015-23143727.11.2015JP
Title (EN) METHOD FOR MANUFACTURING BONDED STRUCTURE AND BONDED STRUCTURE
(FR) PROCÉDÉ DE FABRICATION D'UNE STRUCTURE LIÉE ET STRUCTURE LIÉE
(JA) 接合構造体の製造方法および接合構造体
Abstract:
(EN) This method for manufacturing a bonded structure is a method for manufacturing a bonded structure in which a metal member and a resin member have been bonded together, the metal member having a protrusion on a surface thereof, the method being provided with: a step of forming perforations having an opening in a bonding region of the protrusion; a step of making the resin member come in contact with the bonding region of the protrusion of the metal member under pressurization in a state in which the resin member is separated from the surface of the metal member; and a step of melting the resin member in contact with the bonding region of the metal member and solidifying the melted resin member after the perforations have become filled with the resin.
(FR) Selon l'invention, le procédé de fabrication d'une structure liée est un procédé de fabrication d'une structure liée, dans laquelle un élément métallique et un élément en résine ont été reliés, l'élément métallique présentant une saillie sur une surface correspondante, le procédé comprenant : une étape consistant à former des perforations présentant une ouverture dans une région de liaison de la saillie ; une étape consistant à amener l'élément en résine en contact avec la zone de liaison de la saillie de l'élément métallique sous pressurisation dans un état dans lequel l'élément en résine est séparé de la surface de l'élément métallique ; et une étape consistant à faire fondre l'élément en résine en contact avec la région de liaison de l'élément métallique et à solidifier l'élément de résine fondue après le remplissage des perforations par la résine.
(JA) 接合構造体の製造方法は、金属部材および樹脂部材が接合された接合構造体の製造方法であり、金属部材の表面に突部が設けられており、突部の接合領域に開口を有する穿孔部を形成する工程と、金属部材の表面に対して樹脂部材を離間させた状態で、金属部材の突部の接合領域に樹脂部材を加圧接触させる工程と、金属部材の接合領域に接触する樹脂部材を溶融させ、その溶融された樹脂部材を穿孔部に充填した後に固化させる工程とを備える。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN107921713EP3381660