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1. (WO2017090390) DEVICE AND METHOD FOR MEASURING PIPING THICKNESS USING ULTRASONIC WAVES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090390 International Application No.: PCT/JP2016/082507
Publication Date: 01.06.2017 International Filing Date: 02.11.2016
IPC:
G01B 17/02 (2006.01) ,G01N 29/07 (2006.01) ,G01N 29/265 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
17
Measuring arrangements characterised by the use of infrasonic, sonic, or ultrasonic vibrations
02
for measuring thickness
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29
Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
04
Analysing solids
07
by measuring propagation velocity or propagation time of acoustic waves
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
29
Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
22
Details
26
Arrangements for orientation or scanning
265
by moving the sensor relative to a stationary material
Applicants:
株式会社日立製作所 HITACHI, LTD. [JP/JP]; 東京都千代田区丸の内一丁目6番6号 6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008280, JP
Inventors:
永島 良昭 NAGASHIMA Yoshiaki; JP
Agent:
戸田 裕二 TODA Yuji; JP
Priority Data:
2015-23019126.11.2015JP
Title (EN) DEVICE AND METHOD FOR MEASURING PIPING THICKNESS USING ULTRASONIC WAVES
(FR) DISPOSITIF ET PROCÉDÉ DE MESURE D'ÉPAISSEUR DE TUYAUTERIE UTILISANT DES ONDES ULTRASONORES
(JA) 超音波を用いた配管厚さ測定装置及びその方法
Abstract:
(EN) Provided are a stand-alone device for measuring piping thickness using ultrasonic waves, and a method for the same, whereby the thickness of piping having a structurally discontinuous portion is measured from an inside surface thereof. A device for measuring piping thickness using ultrasonic waves, wherein the device has a plurality of ultrasonic sensors for transmitting and receiving ultrasonic waves to and from a liquid in piping, a means for transmitting and receiving ultrasonic waves, a means for measuring and recording a plurality of reflected wave propagation times for each ultrasonic sensor, and a means for calculating a piping thickness using the propagation times of ultrasonic waves incident essentially perpendicular to a piping inside wall.
(FR) L'invention concerne un procédé et un dispositif autonome pour mesurer l'épaisseur de tuyauterie à l'aide d'ondes ultrasonores, l'épaisseur de tuyauterie comportant une partie à discontinuité structurale étant mesurée depuis une surface intérieure de celle-ci. Le dispositif de mesure d'épaisseur de tuyauterie utilisant des ondes ultrasonores comprend une pluralité de capteurs ultrasonores pour émettre et recevoir des ondes ultrasonores vers et depuis un liquide dans une tuyauterie, des moyens pour émettre et recevoir des ondes ultrasonores, des moyens pour mesurer et enregistrer une pluralité de temps de propagation d'ondes réfléchies pour chaque capteur ultrasonore, et un moyen pour calculer une épaisseur de tuyauterie à l'aide des temps de propagation d'ondes ultrasonores incidentes essentiellement perpendiculaires à une paroi intérieure de tuyauterie.
(JA) 構造不連続部位を有する配管の厚さを内面から測定する独立型(ケーブルレス)の超音波を用いた配管厚さ測定装置およびその方法を提供する。超音波を用いた配管厚さ測定装置において、配管内の液体に対して超音波を送受信する複数の超音波センサと、超音波を送受信する手段と、超音波センサ毎に複数の反射波伝搬時間を測定して記録する手段と、配管内壁に実質的に垂直に入射する超音波の伝搬時間を利用して配管厚さを計算する手段を有する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
MYPI 2018701066