Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017090106) SEMICONDUCTOR DEVICE, INVERTER DEVICE, AND AUTOMOBILE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/090106 International Application No.: PCT/JP2015/083007
Publication Date: 01.06.2017 International Filing Date: 25.11.2015
IPC:
H01L 23/473 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
川瀬 達也 KAWASE Tatsuya; JP
石原 三紀夫 ISHIHARA Mikio; JP
宮本 昇 MIYAMOTO Noboru; JP
中田 洋輔 NAKATA Yosuke; JP
井本 裕児 IMOTO Yuji; JP
Agent:
吉竹 英俊 YOSHITAKE Hidetoshi; JP
Priority Data:
Title (EN) SEMICONDUCTOR DEVICE, INVERTER DEVICE, AND AUTOMOBILE
(FR) DISPOSITIF À SEMI-CONDUCTEUR, DISPOSITIF ONDULEUR, ET AUTOMOBILE
(JA) 半導体装置、インバータ装置及び自動車
Abstract:
(EN) The purpose of the present invention is to provide a technology whereby cooling performance of a semiconductor device can be improved. A semiconductor device of the present invention is provided with: a fin section 16 including a plurality of protruding sections connected to the lower surface of a heat conductive base plate 11; a cooling component 17, which is connected to an inflow port 17a through which a refrigerant to the fin section 16 flows in, and an outflow port 17b through which the refrigerant from the fin section 16 flows out, said cooling component covering the fin section 16; and a header 18, which is provided between the inflow port 17a and the fin section 16, and which is a water reservoir chamber separated from the fin section 16 such that the refrigerant can circulate from the inflow port 17a to the fin section 16.
(FR) Le but de la présente invention est d'élaborer une technologie permettant d'améliorer les performances de refroidissement d'un dispositif à semi-conducteur. Un dispositif à semi-conducteur selon la présente invention comprend : une partie à ailettes (16) comprenant une pluralité de sections saillantes reliées à la surface inférieure d'une plaque de base thermoconductrice (11) ; un composant de refroidissement (17), qui est raccordé à un orifice d'entrée (17a) par lequel un réfrigérant entre vers la partie à ailettes (16) et à un orifice de sortie (17) par lequel le réfrigérant sort de la partie à ailettes (16), ledit composant de refroidissement recouvrant la partie à ailettes (16) ; et un collecteur (18), qui est disposé entre l'orifice d'entrée (17a) et la partie à ailettes (16), et qui est une chambre de réservoir d'eau séparée de la partie à ailettes (16) de manière que le réfrigérant puisse circuler de l'orifice d'entrée (17a) à la partie à ailettes (16).
(JA)  半導体装置の冷却性能を高めることが可能な技術を提供することを目的とする。半導体装置は、伝熱性ベース板11の下面に接続された複数の突起部を含むフィン部16と、フィン部16への冷媒が流入される流入口17a、及び、フィン部16からの冷媒が流出される流出口17bと接続された、フィン部16を覆う冷却部品17と、流入口17aとフィン部16との間に設けられ、流入口17aからフィン部16に冷媒が流通可能にフィン部16と隔てられた水溜め室であるヘッダ18とを備える。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017090106US20180204784CN108292640DE112015007145