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1. (WO2017069156) WIRING BODY, WIRING SUBSTRATE, TOUCH SENSOR, AND METHOD FOR MANUFACTURING A WIRING BODY
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Pub. No.: WO/2017/069156 International Application No.: PCT/JP2016/080970
Publication Date: 27.04.2017 International Filing Date: 19.10.2016
IPC:
H05K 1/02 (2006.01) ,G06F 3/041 (2006.01) ,G06F 3/044 (2006.01) ,H05K 3/20 (2006.01) ,H05K 3/38 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
044
by capacitive means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20
by affixing prefabricated conductor pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
Applicants: FUJIKURA LTD.[JP/JP]; 5-1, Kiba 1-chome, Kohtoh-ku, Tokyo 1358512, JP
Inventors: ISHII, Masaaki; JP
Agent: TOKOSHIE PATENT FIRM; Nishishinjuku KN Bldg., 22-27, Nishishinjuku 7-chome, Shinjuku-ku, Tokyo 1600023, JP
Priority Data:
2015-20569319.10.2015JP
Title (EN) WIRING BODY, WIRING SUBSTRATE, TOUCH SENSOR, AND METHOD FOR MANUFACTURING A WIRING BODY
(FR) CORPS DE CÂBLAGE, SUBSTRAT DE CÂBLAGE, CAPTEUR TACTILE ET PROCÉDÉ DE FABRICATION DE CORPS DE CÂBLAGE
(JA) 配線体、配線基板、タッチセンサ、及び配線体の製造方法
Abstract:
(EN) A first wiring body (3) comprises a plastic part (4) constituted from a plastic material (17), and a linear conductor part (5) constituted from an electroconductive material (16) and formed on the plastic part (4), wherein the plastic part (4) has a flat part (41), a projecting part (42) provided in correspondence to the conductor part (5) and projecting further toward the conductor part (5) side than the flat part (41), and a recess part (43) that is depressed in curved form in the direction heading away from the conductor part (5) relative to the flat part (41). The conductor part (5) has a contact surface (511) that contacts the projecting part (42), and a top surface (512) that is positioned on the opposite side from the contact surface (511) and is substantially parallel to the flat part (41). A side surface (421) of the projecting part (42) and the recess part (43) are continuous.
(FR) La présente invention concerne un premier corps de câblage (3) qui comprend une partie en plastique (4), constituée d'une matière plastique (17), et une partie conducteur linéaire (5), constituée d'un matériau conducteur de l'électricité (16) et formée sur la partie en plastique (4), la partie en plastique (4) ayant une partie plate (41), une partie saillante (42) disposée en correspondance avec la partie conducteur (5) et faisant davantage saillie vers le côté partie conducteur (5) que la partie plate (41), et une partie de renfoncement (43) qui est renfoncée en une forme incurvée dans le sens s'éloignant de la partie conducteur (5) par rapport à la partie plate (41). La partie conducteur (5) présente une surface de contact (511), qui est en contact avec la partie saillante (42), et une surface supérieure (512), qui est positionnée du côté opposé à la surface de contact (511) et qui est sensiblement parallèle à la partie plate (41). Une surface latérale (421) de la partie saillante (42) et la partie de renfoncement (43) sont continues.
(JA) 第1の配線体(3)は、樹脂材料(17)から構成された樹脂部(4)と、導電性材料(16)から構成され、樹脂部(4)上に形成された線状の導体部(5)と、を備え、樹脂部(4)は、平坦部(41)と、導体部(5)に対応して設けられ、平坦部(41)よりも導体部(5)側に向かって突出する突出部(42)と、平坦部(41)及び突出部(42)の間に形成され、平坦部(41)に比べて導体部(5)から離れる方向に湾曲状に凹んだ窪み部(43)と、を有し、導体部(5)は、突出部(42)と接触する接触面(511)と、接触面(511)の反対側に位置し、平坦部(41)と実質的に平行な頂面(512)と、を有し、突出部(42)の側面(421)と窪み部(43)とが連続している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)