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Machine translation
1. (WO2017068917) GLASS WIRED SUBSTRATE AND POWER MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/068917    International Application No.:    PCT/JP2016/078377
Publication Date: 27.04.2017 International Filing Date: 27.09.2016
IPC:
H01L 23/12 (2006.01), H01L 23/15 (2006.01), H05K 1/02 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522 (JP)
Inventors: NAKANISHI, Hiroyuki; (--).
SATOH, Tomotoshi; (--)
Agent: HARAKENZO WORLD PATENT & TRADEMARK; Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041 (JP)
Priority Data:
2015-207309 21.10.2015 JP
Title (EN) GLASS WIRED SUBSTRATE AND POWER MODULE
(FR) SUBSTRAT CÂBLÉ EN VERRE ET MODULE DE PUISSANCE
(JA) ガラス配線基板およびパワーモジュール
Abstract: front page image
(EN)This glass wired substrate is provided with: a support substrate (11) made of glass; a first circuit section (20) arranged on a first surface (11a) of the support substrate (11); and a second circuit section (30) arranged on a second surface (11b) of the support substrate. In the second circuit section (30), a trimmed pattern (31, 33-35) formed of a plurality of slits (32) is formed.
(FR)L'invention concerne un substrat câblé en verre qui comprend : un substrat de support (11) en verre ; une première section de circuit (20) agencée sur une première surface (11a) du substrat de support (11) ; et une seconde section de circuit (30) agencée sur une seconde surface (11b) du substrat de support. Dans la seconde section de circuit (30), un motif rogné (31, 33-35) constitué d'une pluralité de fentes (32) est formé.
(JA)ガラスからなる支持基板(11)と、支持基板(11)の第1面(11a)に配置されている第1回路部(20)と、支持基板(11)の第2面(11b)に配置されている第2回路部(30)とを備え、第2回路部(30)には複数のスリット(32)からなる抜きパターン(31、33~35)が形成されているガラス配線基板。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)