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1. (WO2017067346) STACKED FLIP CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR

Pub. No.:    WO/2017/067346    International Application No.:    PCT/CN2016/098772
Publication Date: Fri Apr 28 01:59:59 CEST 2017 International Filing Date: Tue Sep 13 01:59:59 CEST 2016
IPC: H01L 23/495
H01L 21/60
Applicants: GREAT TEAM BACKEND FOUNDRY (DONGGUAN), LTD
杰群电子科技(东莞)有限公司
Inventors: JIANG, Wei
江伟
CAO, Zhou
曹周
LI, Pengzhao
李朋钊
Title: STACKED FLIP CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Abstract:
A stacked flip chip packaging structure and a manufacturing method therefor. The stacked flip chip packaging structure, comprising: a lead framework (110) comprising a first peripheral framework (111) and a first chip holder (112), a first pin (113), a second pin (114) and a third pin (115) which are integrally arranged with the first peripheral framework (111); a first chip (120) installed upside down on the first chip holder (112); a copper bridge element (130) arranged on the first chip (120); a second chip (140) installed upside down on a second surface of the copper bridge element (130); and a copper bridge framework (150) comprising a second peripheral framework (151) and a second chip holder (152) which is integrally arranged with the second peripheral framework (151), a soldering surface of the second chip holder (152) being electrically connected to a drain electrode of the second chip (140).