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Machine translation
1. (WO2017066342) ELECTRONIC COMPONENT AND PROCESS OF PRODUCING ELETRONIC COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/066342    International Application No.:    PCT/US2016/056671
Publication Date: 20.04.2017 International Filing Date: 12.10.2016
IPC:
H05K 1/02 (2006.01), H01L 21/324 (2006.01)
Applicants: TE CONNECTIVITY CORPORATION [US/US]; 1050 Westlakes Drive Berwyn, PA 19312 (US).
TE CONNECTIVITY GERMANY GMBH [DE/DE]; Amperestasse 12-14 64625 Bensheim (DE)
Inventors: BHARADWAJ, Lavanya; (US).
MATHEWS, Barry, C.; (US).
FRECKMANN, Dominique; (US).
SONEJA, Shallu; (US).
OAR, Michael, A.; (US).
GULSOY, Gokce; (US).
SCHMIDT, Helge; (DE).
LEIDNER, Michael; (DE).
SACHS, Soenke; (DE)
Agent: GERSTNER, Marguerite E.; (US)
Priority Data:
14/881,041 12.10.2015 US
Title (EN) ELECTRONIC COMPONENT AND PROCESS OF PRODUCING ELETRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE ET PROCÉDÉ DE PRODUCTION DE COMPOSANT ÉLECTRONIQUE
Abstract: front page image
(EN)Electronic components (100) and processes of producing electronic components are disclosed. The electronic component includes a substrate (101) and a thermal grain modified layer (103) positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
(FR)La présente invention concerne des composants électroniques (100) et des procédés de production de composants électroniques. Le composant électronique comprend un substrat (101) et une couche modifiée de grain thermique (103) positionnée sur le substrat. La couche modifiée de grain thermique comprend une structure de grain modifiée. La structure de grain modifiée comprend un additif de modification de grain thermique. La présente invention concerne également un procédé de formation du composant électronique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)