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Machine translation
1. (WO2017064776) COMPONENT MOUNTING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/064776    International Application No.:    PCT/JP2015/079075
Publication Date: 20.04.2017 International Filing Date: 14.10.2015
IPC:
H05K 13/04 (2006.01)
Applicants: YAMAHA HATSUDOKI KABUSHIKI KAISHA [JP/JP]; 2500 Shingai, Iwata-shi, Shizuoka 4388501 (JP)
Inventors: TAKAMA, Kazushi; (JP)
Agent: MIYAZONO, Hirokazu; (JP)
Priority Data:
Title (EN) COMPONENT MOUNTING DEVICE
(FR) DISPOSITIF DE MONTAGE DE COMPOSANTS
(JA) 部品実装装置
Abstract: front page image
(EN)This component mounting device (100) is provided with a control unit (9) in which an imaging unit (8) images at least the vicinity of a mounting position (Pa) during the movement of a mounting head (32), height information about the vicinity of the mounting position is acquired on the basis of the imaging result from the imaging unit, and a desired drop position of the mounting head is corrected on the basis of the acquired height information about the vicinity of the mounting position.
(FR)L'invention concerne un dispositif de montage de composants (100) qui est pourvu d'une unité de commande (9) dans laquelle une unité d'imagerie (8) capture des images au moins du voisinage d'une position de montage (Pa) pendant le mouvement d'une tête de montage (32), des informations de hauteur sur le voisinage de la position de montage sont acquises sur la base du résultat d'imagerie de l'unité d'imagerie, et une position de chute souhaitée de la tête de montage est corrigée sur la base des informations de hauteur acquises sur le voisinage de la position de montage.
(JA)この部品実装装置(100)は、実装ヘッド(32)の移動中に、少なくとも撮像部(8)により実装位置(Pa)近傍を撮像させるとともに、撮像部による撮像結果に基づいて実装位置近傍の高さ情報を取得し、取得された実装位置近傍の高さ情報に基づいて実装ヘッドの目標下降位置を補正する制御部(9)を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)