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Machine translation
1. (WO2017062116) REFLECTIVE COATING FOR FLIP-CHIP CHIP-SCALE PACKAGE LEDS IMPROVED PACKAGE EFFICIENCY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/062116    International Application No.:    PCT/US2016/049770
Publication Date: 13.04.2017 International Filing Date: 31.08.2016
IPC:
H01L 33/58 (2010.01), H01L 33/44 (2010.01), H01L 33/48 (2010.01), H01L 33/50 (2010.01), H01L 33/60 (2010.01)
Applicants: LUMILEDS LLC [US/US]; 370 West Trimble Road San José, California 95131 (US).
DIANA, Frederic S. [FR/US]; (US).
DE SMET, Thierry [NL/US]; (US).
GUTH, Gregory [US/US]; (US)
Inventors: DIANA, Frederic S.; (US).
DE SMET, Thierry; (US).
GUTH, Gregory; (US)
Agent: HSIA, David C.; (US)
Priority Data:
62/238,664 07.10.2015 US
Title (EN) REFLECTIVE COATING FOR FLIP-CHIP CHIP-SCALE PACKAGE LEDS IMPROVED PACKAGE EFFICIENCY
(FR) REVÊTEMENT RÉFLÉCHISSANT POUR UNE EFFICACITÉ DE BOÎTIER AMÉLIORÉE DE DEL À BOÎTIER À PUCE À PUCE RETOURNÉE
Abstract: front page image
(EN)A method includes forming a reflective layer (202) on a support (110) where the reflective layer (202) defines openings to the support, placing light-emitting diodes (LEDs) (102) through the openings onto the support (110), forming a non-planar secondary light-emitting layer (106) that conforms to the LEDs and the reflective layer (202), forming a planar optically transparent cap layer (108) over the secondary light-emitting layer, and singulating the LEDs into LED units.
(FR)L'invention concerne un procédé qui consiste à former une couche réfléchissante (202) sur un support (110), laquelle couche réfléchissante (202) délimite des ouvertures sur le support, à placer des diodes électroluminescentes (DEL) (102) à travers les ouvertures sur le support (110), à former une couche électroluminescente secondaire non plane (106) qui est conforme aux DEL et à la couche réfléchissante (202), à former une couche d'encapsulation optiquement transparente plane (108) sur la couche électroluminescente secondaire, et à séparer les DEL en unités de DEL.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)