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Machine translation
1. (WO2017061955) MOLDED CIRCUIT SUBSTRATES
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/061955 International Application No.: PCT/SG2016/050496
Publication Date: 13.04.2017 International Filing Date: 07.10.2016
IPC:
H01L 21/76 (2006.01) ,H05K 3/28 (2006.01) ,H01L 21/56 (2006.01) ,H01L 21/31 (2006.01) ,H01L 21/469 (2006.01) ,H01L 27/14 (2006.01)
Applicants: HEPTAGON MICRO OPTICS PTE. LTD.[SG/SG]; 26 Woodlands Loop Singapore 738317, SG
Inventors: BOJAN, Tesanovic; CH
SPRING, Nicola; CH
GUBSER, Simon; CH
LENART, Robert; CH
CESANA, Mario; CH
Agent: ALLEN & GLEDHILL LLP; One Marina Boulevard #28-00 Singapore 018989, SG
Priority Data:
62/238,40607.10.2015US
Title (EN) MOLDED CIRCUIT SUBSTRATES
(FR) SUBSTRATS DE CIRCUIT MOULÉ
Abstract: front page image
(EN) Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
(FR) L'invention concerne des substrats de circuit moulé comprenant une couche conductrice entourée par une paroi latérale isolante. La paroi latérale isolante comprend en outre un composant structurel pour un module électronique dans lequel le substrat de circuit moulé est incorporé. En conséquence, les substrats de circuit moulé permettent d'obtenir une meilleure performance, de réduire l'épaisseur du module électronique, et de réduire les coûts de fabrication. L'invention concerne également des procédés de fabrication de substrats de circuit moulé qui facilitent le positionnement précis de parois latérales isolantes, de cloisons d'isolation, de contacts électriques et d'autres composants.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)