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1. (WO2017061862) SYSTEM IN PACKAGE (SIP) WITH AN INTEGRATED IN-SITU 3D WAFER LEVEL MONITORING AND CONTROL UNIT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/061862    International Application No.:    PCT/NL2016/050688
Publication Date: 13.04.2017 International Filing Date: 05.10.2016
IPC:
H01L 25/075 (2006.01), H01L 33/00 (2010.01), H05B 33/08 (2006.01)
Applicants: TECHNISCHE UNIVERSITEIT DELFT [NL/NL]; Mekelweg 4 2628 CD Delft (NL)
Inventors: ESFAHANI, Zahra Kolahdouz; (NL).
VAN ZEIJL, Hendrikus Wilhelmus; (NL).
ZHANG, Guo Qi; (NL)
Agent: VOGELS, Leonard Johan Paul; (NL)
Priority Data:
2015596 09.10.2015 NL
Title (EN) SYSTEM IN PACKAGE (SIP) WITH AN INTEGRATED IN-SITU 3D WAFER LEVEL MONITORING AND CONTROL UNIT
(FR) SYSTÈME EN BOÎTIER (SIP) DOTÉ D'UNE UNITÉ DE SURVEILLANCE ET DE COMMANDE SUR TRANCHE 3D IN SITU INTÉGRÉE
Abstract: front page image
(EN)The present invention relates to a System in Package (SiP) with an integrated In-situ 3D wafer level monitoring and control unit arranged to monitor and control performance and reliability of a LED, system on substrate (SoS ) comprising said control unit, a BiCMOS process for making said IC, and a device comprising said SiP.
(FR)La présente invention concerne un système en boîtier (SiP) doté d'une unité de surveillance et de commande sur tranche 3D in situ intégrée conçue pour surveiller et commander les performances et la fiabilité d'une DEL, un système sur substrat (SoS) comprenant ladite unité de commande, un procédé de fabrication BiCMOS dudit circuit intégré, et un dispositif comprenant ledit système en boîtier.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)