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1. (WO2017061408) HEAT SINK
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Pub. No.: WO/2017/061408 International Application No.: PCT/JP2016/079420
Publication Date: 13.04.2017 International Filing Date: 04.10.2016
IPC:
H05K 7/20 (2006.01) ,F28D 15/02 (2006.01) ,H01L 23/427 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
D
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15
Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02
in which the medium condenses and evaporates, e.g. heat-pipes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427
Cooling by change of state, e.g. use of heat pipes
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内二丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
杤木 康行 TOCHIGI Yasuyuki; JP
曾 宏偉 TSENG Hung Wei; TW
朱 光裕 CHU Kuang Yu; TW
目黒 正大 MEGURO Masahiro; JP
川畑 賢也 KAWABATA Kenya; JP
Agent:
アインゼル・フェリックス=ラインハルト EINSEL Felix-Reinhard; JP
前川 純一 MAEKAWA Junichi; JP
二宮 浩康 NINOMIYA Hiroyasu; JP
上島 類 UESHIMA Rui; JP
来間 清志 KURUMA Kiyoshi; JP
Priority Data:
2015-20046008.10.2015JP
Title (EN) HEAT SINK
(FR) DISSIPATEUR THERMIQUE
(JA) ヒートシンク
Abstract:
(EN) Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a heat-receiving plate planar direction. The heat sink has heat-receiving plates that are thermally connected to a heating element, heat pipes that are thermally connected to the heat-receiving plates and are formed from a tube body, and heat dissipating fins that are thermally connected to the heat-receiving plates, wherein the heat pipes are provided in a plurality of layers in the vertical direction with respect to the heat-receiving plate surfaces, and in at least two layers among the plurality of layers, the positions of the heat pipes on the heat-receiving plate surfaces are not identical to each other.
(FR) La présente invention se rapporte à un dissipateur thermique présentant une excellente efficacité de dissipation de chaleur en ce qu'il possède d'excellentes caractéristiques de diffusion thermique dans une direction plane de plaque réceptrice de chaleur. Le dissipateur de chaleur possède des plaques réceptrices de chaleur qui sont thermiquement reliées à un élément chauffant, des caloducs qui sont thermiquement reliés aux plaques réceptrices de chaleur et sont formés à partir d'un corps de tube, et des ailettes de dissipation de chaleur qui sont thermiquement reliées aux plaques réceptrices de chaleur, les caloducs étant prévus dans une pluralité de couches dans la direction verticale par rapport aux surfaces des plaques réceptrices de chaleur, et dans au moins deux couches parmi la pluralité de couches, les positions des caloducs sur les surfaces des plaques réceptrices de chaleur n'étant pas identiques les unes aux autres.
(JA) 受熱プレート平面方向の熱拡散特性に優れていることで、優れた放熱効率を有するヒートシンクを提供する。 発熱体と熱的に接続される受熱プレートと、該受熱プレートと熱的に接続された、管体から形成されたヒートパイプと、該受熱プレートと熱的に接続された放熱フィンと、を有するヒートシンクであって、前記ヒートパイプが、前記受熱プレート表面に対して鉛直方向に複数層設けられ、前記複数層のうち少なくとも2つの層において、前記受熱プレート表面上における前記ヒートパイプの位置が、相互に、同一ではないヒートシンク。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)