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1. (WO2017061193) METHOD FOR PRODUCING WIRING STRUCTURE

Pub. No.:    WO/2017/061193    International Application No.:    PCT/JP2016/075680
Publication Date: Fri Apr 14 01:59:59 CEST 2017 International Filing Date: Fri Sep 02 01:59:59 CEST 2016
IPC: H01L 21/288
C23C 18/16
C23C 18/18
H01L 21/3205
H01L 21/768
H01L 23/12
H01L 23/14
H01L 23/522
Applicants: HAMAMATSU PHOTONICS K.K.
浜松ホトニクス株式会社
Inventors: MURAMATSU Masaharu
村松 雅治
SUZUKI Hisanori
鈴木 久則
YONETA Yasuhito
米田 康人
OTSUKA Shinya
大塚 慎也
TAKAHASHI Hirotaka
高橋 弘孝
Title: METHOD FOR PRODUCING WIRING STRUCTURE
Abstract:
This method for producing a wiring structure is a method for producing a wiring structure provided with a wiring pattern, the method comprising: a first step for forming an insulating layer on a surface of a silicon substrate at least along a region where a wiring pattern is scheduled to be formed; a second step for forming a boron layer on the insulating layer along the formation-scheduled region; and a third step for forming a metal layer on the boron layer by plating.