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1. (WO2017060528) SPACER PARTICLES FOR ADHESIVES
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Pub. No.: WO/2017/060528 International Application No.: PCT/EP2016/074228
Publication Date: 13.04.2017 International Filing Date: 10.10.2016
IPC:
C09J 9/02 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
Applicants: CONPART AS[NO/NO]; Dragonveien 54 NO-2013 Skjetten, NO
Inventors: REDFORD, Keith; NO
KRISTIANSEN, Helge; NO
Agent: MAGRATH, Sally; GB
Priority Data:
1517939.309.10.2015GB
Title (EN) SPACER PARTICLES FOR ADHESIVES
(FR) PARTICULES D'ESPACEMENT POUR ADHÉSIFS
Abstract:
(EN) A particle 10 for use in a conductive adhesive 20 is provided. The particle 10 comprises a core1 having a core diameter. The core is formed of a first material having a first elastic modulus. The particle 10 further comprises a shell 2 around the core 1 which is formed of a second material having a second elastic modulus. The core diameter is greater than or equal to 50% of the particle diameter. The first elastic modulus is greater than the second elastic modulus.
(FR) L'invention concerne une particule 10 pour utilisation dans un adhésif conducteur 20. La particule 10 comprend un noyau 1 présentant un diamètre de noyau. Le noyau est formé d'un premier matériau présentant un premier module élastique. La particule 10 comprend, en outre, une enveloppe 2 autour du noyau 1 qui est formée d'un second matériau présentant un second module élastique. Le diamètre du noyau est supérieur ou égal à 50 % du diamètre de la particule. Le premier module élastique est supérieur au second module élastique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)