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1. (WO2017060280) OPTOELECTRONIC COMPONENT HAVING A LEAD FRAME HAVING A STIFFENING STRUCTURE
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Pub. No.: WO/2017/060280 International Application No.: PCT/EP2016/073752
Publication Date: 13.04.2017 International Filing Date: 05.10.2016
IPC:
H01L 33/00 (2010.01) ,H01L 33/48 (2010.01) ,H01L 33/62 (2010.01) ,H01L 25/075 (2006.01) ,H01L 25/16 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstraße 4 93055 Regensburg, DE
Inventors:
RICHTER, Daniel; DE
Agent:
PATENTANWALTSKANZLEI WILHELM & BECK; Prinzenstr. 13 80639 München, DE
Priority Data:
10 2015 116 855.305.10.2015DE
Title (EN) OPTOELECTRONIC COMPONENT HAVING A LEAD FRAME HAVING A STIFFENING STRUCTURE
(FR) ÉLÉMENT OPTOÉLECTRONIQUE DOTÉ D’UN CHÂSSIS DE CONNEXION POURVU D’UNE STRUCTURE DE RENFORCEMENT
(DE) OPTOELEKTRONISCHES BAUELEMENT MIT EINEM LEITERRAHMEN MIT EINER VERSTEIFUNGSSTRUKTUR
Abstract:
(EN) The invention relates to an optoelectronic component having at least one optoelectronic semiconductor chip, wherein the at least one optoelectronic semiconductor chip is arranged on a top side of a lead frame section (9), wherein the lead frame section (9) has a stiffening structure protruding away from the lead frame section (9) laterally, and wherein the lead frame section (9), the stiffening structure, and the at least one optoelectronic semiconductor chip are embedded in an electrically insulating housing.
(FR) L’invention concerne un élément optoélectronique comprenant au moins une puce semiconductrice optoélectronique, l’au moins une puce semiconductrice optoélectronique étant disposée sur une face supérieure d’une section châssis de connexion (9), la section châssis de connexion (9) présentant une structure de renforcement qui part de la section châssis de connexion (9) vers les côtés ; et la section châssis de connexion (9), la structure de renforcement et l’au moins une puce semiconductrice optoélectronique sont implantées dans un boîtier électriquement isolant.
(DE) Die Erfindung betrifft ein optoelektronisches Bauelement mit wenigstens einem optoelektronischen Halbleiterchip, wobei der wenigstens eine optoelektronische Halbleiterchip auf einer Oberseite eines Leiterrahmenabschnitts (9) angeordnet ist, wobei der Leiterrahmenabschnitt (9) eine seitlich vom Leiterrahmenabschnitt (9) wegragende Versteifungsstruktur aufweist, und wobei der Leiterrahmenabschnitt (9), die Versteifungsstruktur und der weingstens eine optoelektronische Halbleiterchip in einem elektrisch isolierenden Gehäuse eingebettet sind.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)