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1. (WO2017059382) MICRO HEAT TRANSFER ARRAYS, MICRO COLD PLATES, AND THERMAL MANAGEMENT SYSTEMS FOR COOLING SEMICONDUCTOR DEVICES, AND METHODS FOR USING AND MAKING SUCH ARRAYS, PLATES, AND SYSTEMS
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Pub. No.: WO/2017/059382 International Application No.: PCT/US2016/055044
Publication Date: 06.04.2017 International Filing Date: 30.09.2016
IPC:
H01L 23/373 (2006.01) ,H01L 21/48 (2006.01) ,F28F 13/06 (2006.01) ,F28F 3/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
F
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13
Arrangements for modifying heat transfer, e.g. increasing, decreasing
06
by affecting the pattern of flow of the heat-exchange media
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
F
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3
Plate-like or laminated elements; Assemblies of plate-like or laminated elements
12
Elements constructed in the shape of a hollow panel, e.g. with channels
Applicants:
MICROFABRICA INC. [US/US]; c/o Dennis R. Smalley 7911 Haskell Avenue Van Nuys, California 91406, US
Inventors:
CHEN, Richard T.; US
TAN, Will J.; US
Agent:
SMALLEY, Dennis R.; US
Priority Data:
62/235,54730.09.2015US
62/274,05631.12.2015US
62/316,47031.03.2016US
62/321,84013.04.2016US
62/355,55728.06.2016US
Title (EN) MICRO HEAT TRANSFER ARRAYS, MICRO COLD PLATES, AND THERMAL MANAGEMENT SYSTEMS FOR COOLING SEMICONDUCTOR DEVICES, AND METHODS FOR USING AND MAKING SUCH ARRAYS, PLATES, AND SYSTEMS
(FR) MICRO-RÉSEAUX DE TRANSFERT DE CHALEUR, MICRO-PLAQUES FROIDES, ET SYSTÈMES DE GESTION THERMIQUE DE REFROIDISSEMENT DE DISPOSITIFS À SEMI-CONDUCTEUR, ET PROCÉDÉS D'UTILISATION ET DE FABRICATION DE CES RÉSEAUX, PLAQUES, ET SYSTÈMES
Abstract:
(EN) Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
(FR) Des modes de réalisation de la présente invention concernent des réseaux de transfert de chaleur, des plaques froides comprenant des réseaux de transfert de chaleur ainsi que des entrées et des sorties, et des systèmes de gestion thermique comprenant des plaques froides, des pompes et des échangeurs de chaleur. Ces dispositifs et systèmes peuvent être utilisés pour assurer le refroidissement de dispositifs à semi-conducteur et, en particulier, de dispositifs qui produisent de fortes concentrations de chaleur. Les réseaux de transfert de chaleur peuvent comprendre des microcanaux de microjets, des ailettes, et même des microjets intégrés et des ailettes.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)