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Machine translation
1. (WO2017057985) METHOD FOR BONDING STACKED SUPERCONDUCTING WIRES, AND SUPERCONDUCTING WIRE UNIT STACK-BONDED BY SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/057985    International Application No.:    PCT/KR2016/011044
Publication Date: 06.04.2017 International Filing Date: 04.10.2016
IPC:
H01B 12/02 (2006.01), H01B 13/00 (2006.01), H01B 1/02 (2006.01)
Applicants: KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE [KR/KR]; 12, Bulmosan-ro 10beon-gil, Seongsan-gu Changwon-si Gyeongsangnam-do 51543 (KR)
Inventors: SOHN, Myung Hwan; (KR).
HA, Hong Soo; (KR).
SIM, Ki Deok; (KR).
LEE, Won Jae; (KR).
HA, Dong Woo; (KR)
Agent: PUKYUNG INTERNATIONAL PATENT AND LAW FIRM; Daehan Tower Bldg.6th floor, 12, Beobwonnam-ro 15beon-gil Yeonje-gu Busan 47511 (KR)
Priority Data:
10-2015-0139131 02.10.2015 KR
Title (EN) METHOD FOR BONDING STACKED SUPERCONDUCTING WIRES, AND SUPERCONDUCTING WIRE UNIT STACK-BONDED BY SAME
(FR) PROCÉDÉ DE SOUDURE DE FILS SUPRACONDUCTEURS EMPILÉS, ET UNITÉ DE FIL SUPRACONDUCTEUR SOUDÉE EN PILE PAR CELUI-CI
(KO) 적층된 초전도선재의 접합방법 및 이를 통해 적층 접합되는 초전도선재유니트
Abstract: front page image
(EN)The present invention provides a method of manufacturing a superconducting wire, comprising the steps of: charging a plurality of superconducting wires which are in a state separated from each other in a vacuum chamber; depositing copper particles by vacuum evaporating, in a vacuum atmosphere, the copper particles in an area where the plurality of superconducting wires are stacked; and passing the plurality of superconducting wires and the copper particles attached between the superconducting wires together through a pressure roller to form the copper particles as a copper stabilization layer and bond the superconducting wires to each other via the copper stabilization layer. As such, it is possible to form a thin copper stabilization layer between the plurality of superconducting wires or between the superconducting wires and a reinforcement wire through vacuum evaporation by using the copper particles having high purity, thereby obtaining an effect of increasing electric current per unit area. In addition, as the copper particles are vacuum evaporated it is possible to prevent the superconducting wires and the copper stabilization layer from being separated due to a difference in the thermal expansion coefficient even when moving from room temperature to a cryogenic temperature.
(FR)La présente invention concerne un procédé de fabrication d'un fil supraconducteur, comportant les étapes consistant à: charger une pluralité de fils supraconducteurs qui sont dans un état séparé les uns des autres dans une chambre à vide; déposer des particules de cuivre en faisant s'évaporer sous vide, dans un atmosphère sous vide, les particules de cuivre dans une zone où est empilée la pluralité de fils supraconducteurs; et faire passer la pluralité de fils supraconducteurs et les particules de cuivre fixées entre les fils supraconducteurs ensemble à travers un rouleau de pression pour façonner les particules de cuivre en une couche de stabilisation en cuivre et souder les fils supraconducteurs entre eux via la couche de stabilisation en cuivre. Ainsi, il est possible de former une couche mince de stabilisation en cuivre entre la pluralité de fils supraconducteurs ou entre les fils supraconducteurs et un fil de renfort par évaporation sous vide en utilisant les particules de cuivre de haute pureté, obtenant ainsi un effet d'augmentation du courant électrique par unité d'aire. De plus, comme les particules de cuivre sont évaporées sous vide, il est possible d'empêcher les fils supraconducteurs et la couche de stabilisation en cuivre d'être séparés du fait d'une différence dans le coefficient de dilatation thermique même lors du passage de la température ambiante à une température cryogénique.
(KO)본 발명은, 복수의 초전도선재를 이격되는 상태로 각각 진공챔버 내에 장입하는 단계와; 진공 분위기 하에서 복수의 상기 초전도선재가 서로 적층되는 영역에 구리(Cu) 입자를 진공증착(vacuum evaporation)하여 상기 구리 입자를 부착하는 단계와; 복수의 상기 초전도선재 및 상기 초전도선재 사이에 부착된 상기 구리 입자를 함께 가압롤러를 통과시켜 상기 구리 입자를 구리 안정화층으로 형성시킴과 동시에 상기 구리 안정화층을 매개로 상기 초전도선재 상호 간을 접합시키는 단계를 포함하는 것을 기술적 요지로 한다. 이에 의해 복수의 초전도선재 또는 보강선재와 초전도선재 사이에 순도가 높은 구리 입자를 이용하여 진공증착을 통해 두께가 얇은 구리 안정화층을 형성할 수 있으며, 이를 통해 단위면적당 전류가 증가되는 효과를 얻을 수 있다. 또한 구리 입자를 진공증착함에 의해 상온에서 극저온으로 이동하더라도 열팽창계수 차이에 의해 초전도선재와 구리 안정화층이 분리되는 것을 방지할 수 있는 효과가 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)