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1. (WO2017057696) POSITIONAL DEVIATION DETECTION DEVICE, VAPOR-PHASE GROWTH DEVICE, AND POSITIONAL DEVIATION DETECTION METHOD
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Pub. No.: WO/2017/057696 International Application No.: PCT/JP2016/079067
Publication Date: 06.04.2017 International Filing Date: 30.09.2016
IPC:
H01L 21/205 (2006.01) ,C23C 16/455 (2006.01) ,C23C 16/52 (2006.01) ,G01B 11/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
205
using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
455
characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
52
Controlling or regulating the coating process
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
Applicants:
株式会社ニューフレアテクノロジー NUFLARE TECHNOLOGY, INC. [JP/JP]; 神奈川県横浜市磯子区新杉田町8番1 8-1, Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa 2358522, JP
Inventors:
伊藤 英樹 ITO Hideki; JP
早野 貴憲 HAYANO Takanori; JP
Agent:
永井 浩之 NAGAI Hiroshi; JP
中村 行孝 NAKAMURA Yukitaka; JP
佐藤 泰和 SATO Yasukazu; JP
朝倉 悟 ASAKURA Satoru; JP
関根 毅 SEKINE Takeshi; JP
赤岡 明 AKAOKA Akira; JP
川崎 康 KAWASAKI Yasushi; JP
Priority Data:
2015-19691902.10.2015JP
Title (EN) POSITIONAL DEVIATION DETECTION DEVICE, VAPOR-PHASE GROWTH DEVICE, AND POSITIONAL DEVIATION DETECTION METHOD
(FR) DISPOSITIF DE DÉTECTION D'ÉCART DE POSITION, DISPOSITIF DE CROISSANCE EN PHASE VAPEUR ET PROCÉDÉ DE DÉTECTION D'ÉCART DE POSITION
(JA) 位置ずれ検出装置、気相成長装置および位置ずれ検出方法
Abstract:
(EN) [Problem] To enable precise detection of a positional deviation of an object being measured such as a wafer. [Solution] This positional deviation detection device includes an irradiation unit that emits an optical signal to an object being measured, a light receiving unit that receives the optical signal reflected by the object being measured, a first light-reception range determining unit that determines whether or not a position where the optical signal is received by the light receiving unit deviates from a first light-reception range, and a positional deviation detection unit that determines that the position of the object being measured deviates in a case where the first light-reception range determining unit determines that the position deviates.
(FR) La présente invention traite du problème consistant à permettre une détection précise d'un écart de position d'un objet mesuré, comme par exemple une plaquette. La solution de l'invention porte sur un dispositif de détection d'écart de position comprenant une unité de rayonnement qui émet un signal optique vers un objet mesuré, une unité de réception de lumière qui reçoit le signal optique réfléchi par l'objet mesuré, une première unité de détermination de plage de réception de lumière qui détermine si oui ou non une position où le signal optique est reçu par l'unité de réception de lumière s'écarte d'une première plage de réception de lumière et une unité de détection d'écart de position qui détermine que la position de l'objet mesuré dévie si la première unité de détermination de plage de réception de lumière détermine que la position dévie.
(JA) 【課題】ウエハ等の測定対象物の位置ずれを精度よく検出可能にする。 【解決手段】位置ずれ検出装置は、測定対象物に対して光信号を出射する照射部と、測定対象物にて反射された光信号を受光する受光部と、受光部における光信号の受光位置が予め定めた第1受光範囲から外れているか否かを判定する第1受光範囲判定部と、第1受光範囲判定部にて外れていると判定されると、測定対象物が位置ずれを起こしたと判断する位置ずれ検出部と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)