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1. (WO2017057637) LIQUID COMPOSITION FOR SEALING, SEALING MATERIAL AND ELECTRONIC COMPONENT DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/057637    International Application No.:    PCT/JP2016/078933
Publication Date: 06.04.2017 International Filing Date: 29.09.2016
IPC:
C08L 63/00 (2006.01), C08G 59/68 (2006.01), C08K 3/00 (2006.01), H01L 21/60 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
Inventors: TAKEUCHI, Yuma; (JP).
OSAKA, Masahiko; (JP).
TAKAHASHI, Hisato; (JP)
Agent: TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2015-191837 29.09.2015 JP
Title (EN) LIQUID COMPOSITION FOR SEALING, SEALING MATERIAL AND ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION LIQUIDE POUR SCELLEMENT, MATÉRIAU DE SCELLEMENT ET DISPOSITIF DE COMPOSANT ÉLECTRONIQUE
(JA) 封止用液状組成物、封止材、及び電子部品装置
Abstract: front page image
(EN)Provided is a liquid composition for sealing, which contains an epoxy compound having an epoxy group, an oxetane compound having an oxetane ring, a polymerization initiator and an inorganic filler. Also provided are: a sealing material which is obtained by curing this liquid composition for sealing; and an electronic component device which comprises this sealing material.
(FR)L'invention concerne une composition liquide pour scellement, qui contient un composé époxy ayant un groupe époxy, un composé d'oxétane ayant un cycle oxétane, un initiateur de polymérisation et une charge inorganique. L'invention concerne également : un matériau d'étanchéité qui est obtenu par durcissement de cette composition liquide pour sceller ; et un dispositif de composant électronique qui comprend ce matériau d'étanchéité.
(JA)エポキシ基を有するエポキシ化合物、オキセタン環を有するオキセタン化合物、重合開始剤、及び無機充填材を含有する封止用液状組成物を提供する。また、この封止用液状組成物を硬化してなる封止材、及びこの封止材を有する電子部品装置を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)