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1. (WO2017057637) LIQUID COMPOSITION FOR SEALING, SEALING MATERIAL AND ELECTRONIC COMPONENT DEVICE

Pub. No.:    WO/2017/057637    International Application No.:    PCT/JP2016/078933
Publication Date: Fri Apr 07 01:59:59 CEST 2017 International Filing Date: Fri Sep 30 01:59:59 CEST 2016
IPC: C08L 63/00
C08G 59/68
C08K 3/00
H01L 21/60
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: TAKEUCHI, Yuma
竹内 勇磨
OSAKA, Masahiko
小坂 正彦
TAKAHASHI, Hisato
高橋 寿登
Title: LIQUID COMPOSITION FOR SEALING, SEALING MATERIAL AND ELECTRONIC COMPONENT DEVICE
Abstract:
Provided is a liquid composition for sealing, which contains an epoxy compound having an epoxy group, an oxetane compound having an oxetane ring, a polymerization initiator and an inorganic filler. Also provided are: a sealing material which is obtained by curing this liquid composition for sealing; and an electronic component device which comprises this sealing material.