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1. (WO2017057519) ADHESIVE TAPE FOR ELECTRONIC COMPONENT
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Pub. No.: WO/2017/057519 International Application No.: PCT/JP2016/078733
Publication Date: 06.04.2017 International Filing Date: 28.09.2016
IPC:
C09J 7/02 (2006.01) ,B32B 15/08 (2006.01) ,B32B 27/00 (2006.01) ,C09J 179/08 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/60 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
179
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/-C09J177/263
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
株式会社巴川製紙所 TOMOEGAWA CO., LTD. [JP/JP]; 東京都中央区京橋一丁目7番1号 1-7-1, Kyobashi, Chuo-ku, Tokyo 1048335, JP
Inventors:
清水 勇気 SHIMIZU Yuki; JP
市川 貴勝 ICHIKAWA Takamasa; JP
Agent:
棚井 澄雄 TANAI Sumio; JP
鈴木 史朗 SUZUKI Shirou; JP
川越 雄一郎 KAWAGOE Yuichiro; JP
Priority Data:
2015-19150029.09.2015JP
Title (EN) ADHESIVE TAPE FOR ELECTRONIC COMPONENT
(FR) BANDE ADHÉSIVE POUR COMPOSANT ÉLECTRONIQUE
(JA) 電子部品用接着テープ
Abstract:
(EN) The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, characterized in that a metal layer 1, a first adhesive layer 3, an insulation layer 5, and a second adhesive layer 7 are layered therein in this order, the thickness of the metal layer 1 is 200 µm or less, and the storage modulus of the first adhesive layer 3 at 200°C after heat treatment for 1 hour at 175°C is 1×106 Pa or greater.
(FR) La présente invention vise à fournir une bande adhésive pour un composant électronique, la bande adhésive présentant d'excellentes propriétés de câblage filaire et une excellente aptitude au façonnage. L'invention concerne une bande adhésive pour un composant électronique, caractérisée en ce qu'une couche de métal 1, une première couche adhésive 3, une couche d'isolation 5, et une seconde couche adhésive 7 sont disposées en couches à l'intérieur de la bande dans cet ordre, l'épaisseur de la couche de métal 1 est de 200 µm ou moins, et le module de conservation de la première couche adhésive 3 à 200 °C après traitement thermique pendant 1 heure à 175 °C est de 1 × 106 Pa ou plus.
(JA) ワイヤボンディング性および加工性に優れた電子部品用接着テープを提供することを目的とし、金属層1と第一の接着層3と絶縁層5と第二の接着層7とがこの順に積層しており、金属層1の厚みが200μm以下であり、第一の接着層3の、175℃1時間の加熱処理後の200℃における貯蔵弾性率が1×10Pa以上であることを特徴とする電子部品用接着テープを提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)