Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017057429) THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/057429 International Application No.: PCT/JP2016/078570
Publication Date: 06.04.2017 International Filing Date: 28.09.2016
IPC:
H01L 21/52 (2006.01) ,C09J 7/02 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/301 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-1-2,Shimohozumi,Ibaraki-shi, Osaka 5678680, JP
Inventors:
菅生 悠樹 SUGO, Yuki; JP
鎌倉 菜穂 KAMAKURA, Nao; JP
Agent:
特許業務法人 ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE; 大阪府大阪市淀川区西中島5丁目13-9 新大阪MTビル1号館2階 First Shin-Osaka MT Bldg. 2nd Floor, 5-13-9 Nishinakajima, Yodogawa-ku, Osaka-shi, Osaka 5320011, JP
Priority Data:
2015-19420630.09.2015JP
2016-18450521.09.2016JP
Title (EN) THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
(FR) FEUILLE DE LIAISON THERMIQUE, ET FEUILLE DE LIAISON THERMIQUE AVEC RUBAN DE DÉCOUPAGE EN DÉS
(JA) 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
Abstract:
(EN) A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of the layer was in the range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.
(FR) L'invention concerne une feuille de liaison thermique pourvue d'une couche dans laquelle, après chauffage de la couche de 80 °C à 300 °C à une vitesse d'augmentation de température de 1,5 °C/seconde sous une mise sous pression de 10 MPa puis maintien à 300 °C pendant 2,5 minutes, la dureté de la couche est dans la plage de 1,5 GPa à 10 GPa en mesurant à l'aide d'un nanopénétrateur.
(JA) 10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持した後の硬さが、ナノインデンターを用いた計測において、1.5GPa~10GPaの範囲内である層を有する加熱接合用シート。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)