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1. (WO2017057429) THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2017/057429    International Application No.:    PCT/JP2016/078570
Publication Date: 06.04.2017 International Filing Date: 28.09.2016
IPC:
H01L 21/52 (2006.01), C09J 7/02 (2006.01), C09J 9/02 (2006.01), C09J 11/04 (2006.01), C09J 201/00 (2006.01), H01L 21/301 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-1-2,Shimohozumi,Ibaraki-shi, Osaka 5678680 (JP)
Inventors: SUGO, Yuki; (JP).
KAMAKURA, Nao; (JP)
Agent: UNIUS PATENT ATTORNEYS OFFICE; First Shin-Osaka MT Bldg. 2nd Floor, 5-13-9 Nishinakajima, Yodogawa-ku, Osaka-shi, Osaka 5320011 (JP)
Priority Data:
2015-194206 30.09.2015 JP
2016-184505 21.09.2016 JP
Title (EN) THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
(FR) FEUILLE DE LIAISON THERMIQUE, ET FEUILLE DE LIAISON THERMIQUE AVEC RUBAN DE DÉCOUPAGE EN DÉS
(JA) 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
Abstract: front page image
(EN)A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of the layer was in the range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.
(FR)L'invention concerne une feuille de liaison thermique pourvue d'une couche dans laquelle, après chauffage de la couche de 80 °C à 300 °C à une vitesse d'augmentation de température de 1,5 °C/seconde sous une mise sous pression de 10 MPa puis maintien à 300 °C pendant 2,5 minutes, la dureté de la couche est dans la plage de 1,5 GPa à 10 GPa en mesurant à l'aide d'un nanopénétrateur.
(JA)10MPaの加圧下で、80℃から300℃まで昇温速度1.5℃/秒にて昇温した後、300℃で2.5分間保持した後の硬さが、ナノインデンターを用いた計測において、1.5GPa~10GPaの範囲内である層を有する加熱接合用シート。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)