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1. (WO2017057128) THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE

Pub. No.:    WO/2017/057128    International Application No.:    PCT/JP2016/077835
Publication Date: Fri Apr 07 01:59:59 CEST 2017 International Filing Date: Thu Sep 22 01:59:59 CEST 2016
IPC: H01L 21/52
C09J 7/02
C09J 9/02
C09J 11/04
H01L 21/301
Applicants: NITTO DENKO CORPORATION
日東電工株式会社
Inventors: SUGO, Yuki
菅生 悠樹
KAMAKURA, Nao
鎌倉 菜穂
Title: THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
Abstract:
Provided is a thermal bonding sheet that prevents the material thereof from overflowing during adhering and from traveling up to the surface of the object to be adhered, and that obtains a strong sintered layer following sintering. A thermal bonding sheet provided with a layer in which, when the layer is analyzed by differential thermogravimetric analysis from 23°C to 500°C under the conditions of a temperature increase rate of 10°C/minute in air atmosphere, the value obtained by subtracting the weight loss (%) at 300°C from the weight loss (%) at 500°C is within the range of -1% to 0%.