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1. (WO2017057009) FILM FOR FORMING PROTECTIVE FILM

Pub. No.:    WO/2017/057009    International Application No.:    PCT/JP2016/077204
Publication Date: Fri Apr 07 01:59:59 CEST 2017 International Filing Date: Fri Sep 16 01:59:59 CEST 2016
IPC: H01L 21/301
H01L 23/00
Applicants: TAIYO INK MANUFACTURING CO., LTD.
太陽インキ製造株式会社
Inventors: NITA Yutaka
二田 完
SATO Kazuya
佐藤 和也
Title: FILM FOR FORMING PROTECTIVE FILM
Abstract:
Provided is a film for forming a protective film, the film being capable of suppressing a semiconductor chip from being electrostatically destroyed, even if a chip has been picked up having gone through a step for peeling a surface protective film, regardless of the type of surface protective film, and as a result, makes it possible to obtain a semiconductor chip having high quality reliability. This film for forming a protective film is a film for forming a protective film to be provided on the back surface of a circuit forming surface of a semiconductor wafer, and is characterized in that the relative permittivity of the semiconductor wafer and the film at a measurement frequency of 10 Hz satisfies formula (1). (1): |εS-εF|≤9 (In the formula, εS represents the relative permittivity of the semiconductor wafer at a measurement frequency of 10 Hz, and εF represents the relative permittivity of the film for forming a protective film at a measurement frequency of 10 Hz).