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1. (WO2017056355) SEMICONDUCTOR DEVICE, ULTRASONIC IMAGE PICKUP DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ULTRASONIC IMAGING SYSTEM

Pub. No.:    WO/2017/056355    International Application No.:    PCT/JP2016/003366
Publication Date: Fri Apr 07 01:59:59 CEST 2017 International Filing Date: Sat Jul 16 01:59:59 CEST 2016
IPC: H01L 21/822
A61B 8/14
H01L 21/336
H01L 21/76
H01L 21/762
H01L 21/8234
H01L 27/04
H01L 27/06
H01L 27/08
H01L 27/088
H01L 27/12
H01L 29/78
H01L 29/786
H01L 29/861
H01L 29/868
Applicants: SONY CORPORATION
ソニー株式会社
Inventors: MORIMOTO, Rui
森本 類
Title: SEMICONDUCTOR DEVICE, ULTRASONIC IMAGE PICKUP DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ULTRASONIC IMAGING SYSTEM
Abstract:
[Problem] To provide a semiconductor device that is provided with a protection circuit having excellent characteristics even with a small area, an ultrasonic image pickup device, a semiconductor device manufacturing method, and an ultrasonic imaging system. [Solution] A semiconductor device of the present art is provided with an integrated circuit that is formed on an SOI substrate, which is provided with a silicon substrate formed of crystalline silicon, a BOX layer laminated on the silicon substrate, and an SOI layer laminated on the BOX layer. The semiconductor device is also provided with a protection circuit and an element isolation region. The protection circuit is provided with a semiconductor region, which constitutes the integrated circuit, and has crystalline orientation that is same as that of the silicon substrate. The element isolation region penetrates the SOI substrate, and isolates the protection circuit.