A card substrate laminating device (102) includes a transfer ribbon (104) and a transfer roller (150). The transfer ribbon includes a carrier layer (122) and a transfer layer (120) attached to the carrier layer. The transfer roller is configured to heat and transfer a portion of the transfer layer from the carrier layer to a surface (106) of a card substrate (108). The transfer roller has a circumference that is less than one-half of a length (168 or 169) of the card substrate. In a method of laminating a card substrate, a card substrate (108) is fed (190) along a processing path (156) using a transport mechanism (154). A portion of a transfer layer (120) of a transfer ribbon (104) is transferred to a surface (106) of the card substrate using a transfer roller (150) by heating (192) the transfer roller, pressing (194) the portion of the transfer layer against the surface of the card substrate using the transfer roller, rotating (196) the transfer roller about a central axis (178) at least two times during the pressing step, and removing (198) a carrier layer (122) of the transfer ribbon from the portion of the transfer layer.