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1. (WO2017055576) METHOD AND DEVICE FOR LASER PROCESSING OF TRANSPARENT MATERIALS

Pub. No.:    WO/2017/055576    International Application No.:    PCT/EP2016/073460
Publication Date: Fri Apr 07 01:59:59 CEST 2017 International Filing Date: Sat Oct 01 01:59:59 CEST 2016
IPC: C03B 33/02
B23K 26/06
B23K 26/073
B23K 26/064
Applicants: UAB ALTECHNA R&D
Inventors: MIKUTIS, Mindaugas
Title: METHOD AND DEVICE FOR LASER PROCESSING OF TRANSPARENT MATERIALS
Abstract:
Invention relates to the field of lasers, particularly to laser processing of transparent materials and can be used for cutting, breaking and other kind of processing of transparent materials, such as glass, chemically strengthened glass, sapphire and other crystalline materials, employing ultrashort pulse asymmetric Gauss-Bessel intensity profile laser beam. Gaussian intensity profile ultrashort pulse laser beam is transformed to asymmetric Gauss-Bessel intensity profile laser beam by inserting an optical element in Gaussian or Gauss-Bessel intensity profile laser beam path. Asymmetry of Gauss-Bessel intensity profile laser beam is set by selecting appropriate material of the optical element and/or parameters of the optical element and/or position of the optical element in the optical beam path in such a manner, that Gauss-Bessel intensity profile laser beam, localized in the workpiece, has an elongated shape in the propagation direction of the laser beam and in the plane, perpendicular to the direction of propagation of said laser beam and induces correspondingly elongated shape damage region in the workpiece. Controlled displacement of the workpiece and the laser beam in respect to each other is performed to create a required number of additional elongated shape damage regions and to arrange them in the workpiece longitudinally one after other along the predefined trajectory forming the cutting and/or breaking plane of the workpiece.