Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017054248) FLIP-CHIP LED MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/054248 International Application No.: PCT/CN2015/091418
Publication Date: 06.04.2017 International Filing Date: 02.10.2015
IPC:
H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants:
魏晓敏 WEI, Xiaomin [CN/CN]; CN
Inventors:
魏晓敏 WEI, Xiaomin; CN
Priority Data:
Title (EN) FLIP-CHIP LED MODULE
(FR) MODULE DE DEL À PUCE RETOURNÉE
(ZH) 倒装LED模组
Abstract:
(EN) A flip-chip LED module comprising: a substrate and flip-chip LED chips (2) provided on the substrate (1). The flip-chip LED module also comprises: a fluorescent powder layer (3). The fluorescent powder layer (3) covers at least two of the flip-chip LED chips (2); and, the fluorescent powder layer is provided with a fluorescent powder at the areas of the flip-chip LED chips. As such, with the fluorescent powder layer covering directly the flip-chip LED chips, a work process of applying the fluorescent powder is obviated, the evenness of the fluorescent powder on the flip-chip LED chips is ensured, production efficiency is increased, and usage of the fluorescent powder is reduced.
(FR) L'invention concerne un module de DEL à puce retournée comprenant : un substrat et des puces de DEL à puce retournée (2) disposées sur le substrat (1). Le module de DEL à puce retournée comprend également : une couche de poudre fluorescente (3). La couche de poudre fluorescente (3) recouvre au moins deux des puces de DEL à puce retournée (2) ; et, la couche de poudre fluorescente est pourvue d'une poudre fluorescente au niveau des zones des puces de DEL à puce retournée. En tant que tel, la couche de poudre fluorescente recouvrant directement les puces de DEL à puce retournée, un processus de travail consistant à appliquer la poudre fluorescente est évité, la planéité de la poudre fluorescente sur les puces de DEL à puce retournée est assurée, l'efficacité de la production est augmentée, et l'utilisation de la poudre fluorescente est réduite.
(ZH) 一种倒装LED模组,包括:基板以及设置于所述基板(1)上的倒装LED芯片(2),所述倒装LED模组还包括:荧光粉层(3),所述荧光粉层(3)覆盖于至少两个所述倒装LED芯片上(2),且所述荧光粉层仅在所述倒装LED芯片区域设置有荧光粉。这样,采用荧光粉层直接覆盖于倒装LED芯片上方,可以减少涂覆荧光粉的工序,保证了倒装LED芯片上荧光粉的均匀性,提高了生产效率,并且节约了荧光粉用料。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)