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1. (WO2017041491) ENCAPSULATION METHOD FOR FLIP CHIP

Pub. No.:    WO/2017/041491    International Application No.:    PCT/CN2016/080209
Publication Date: Fri Mar 17 00:59:59 CET 2017 International Filing Date: Wed Apr 27 01:59:59 CEST 2016
IPC: H01L 21/60
H01L 33/48
H01L 33/62
Applicants: KE, Quan
柯全
Inventors: KE, Quan
柯全
YI, Futing
伊福廷
PAN, Ming
潘明
Title: ENCAPSULATION METHOD FOR FLIP CHIP
Abstract:
An encapsulation method for a flip chip, comprising: electroforming metal on an electrode surface of a flip chip and a surface of an encapsulation substrate simultaneously to realize a connection between the electrode of the flip chip and the encapsulation substrate through metal. The encapsulation method specifically comprises: S1, setting an encapsulation substrate around a flip chip; S2, plating a metal conducting film on an electrode surface of the flip chip and a surface of the encapsulation substrate; S3, coating a photoresist on a surface of the metal conducting film; S4, aligning and photoetching an electrode structure on a photoetching plate and an electrode structure of the flip chip on a photoetching machine to obtain a photoresist structural model, and covering an insulating part between electrodes with the photoresist; S5, taking the metal conducting film as the electrode, electroforming metal inside the photoresist structural model to enable the interior of the photoresist structural model to be full of metal; and S6, removing the photoresist covering the insulating part and removing the metal conducting film covered by the photoresist. The encapsulation method adopts electroforming and photoetching technologies, and thus the process is simplified and the production efficiency is improved.