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1. (WO2017041454) HIGH THERMAL CONDUCTIVITY COMPOSITE INTERFACE MATERIAL AND PREPARATION METHOD THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/041454 International Application No.: PCT/CN2016/074689
Publication Date: 16.03.2017 International Filing Date: 26.02.2016
IPC:
C08L 83/07 (2006.01) ,C08K 13/02 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08K 5/053 (2006.01) ,C08K 3/38 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
13
Use of mixtures of ingredients not covered by any single one of main groups C08K3/-C08K11/128
02
Organic and inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
05
Alcohols; Metal alcoholates
053
Polyhydroxylic alcohols
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
Applicants:
中兴通讯股份有限公司 ZTE CORPORATION [CN/CN]; 中国广东省深圳市 南山区高新技术产业园科技南路中兴通讯大厦 ZTE Plaza, Keji South Road, Hi-Tech Industrial Park, Nanshan District Shenzhen, Guangdong 518057, CN
Inventors:
彭典明 PENG, Dianming; CN
刘伟德 LIU, Weide; CN
郑华伟 ZHENG, Huawei; CN
郑金桥 ZHENG, Jinqiao; CN
张航 ZHANG, Hang; CN
汪磊 WANG, Lei; CN
刘欣 LIU, Xin; CN
焦兰 JIAO, Lan; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201510571436.009.09.2015CN
Title (EN) HIGH THERMAL CONDUCTIVITY COMPOSITE INTERFACE MATERIAL AND PREPARATION METHOD THEREFOR
(FR) MATÉRIAU D’INTERFACE COMPOSITE À CONDUCTIVITÉ THERMIQUE ÉLEVÉE ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种高导热复合界面材料及其制备方法
Abstract:
(EN) Provided is a high thermal conductivity composite interface material, comprising an organosilicon polymer, a thermal conductivity powder and an adjuvant, wherein the thermal conductivity powder comprises a spherical thermal conductivity powder and a polyhedral thermal conductivity powder, and wherein the ratio in parts by weight of the organosilicon polymer, the spherical thermal conductivity powder, the polyhedral thermal conductivity powder and the adjuvant is as follows: 5-10 of the organosilicon polymer, 75-90 of the spherical thermal conductivity powder, 1-5 of the polyhedral thermal conductivity powder, and 0.5-1 of the adjuvant. Also provided is a method for preparing a polyhedral high thermal conductivity composite interface material. The high thermal conductivity composite interface material is prepared by mixing and calendering an organosilicon polymer, a thermal conductivity powder and an adjuvant, wherein the thermal conductivity powder comprises a spherical thermal conductivity powder and a polyhedral thermal conductivity powder. By utilizing the polyhedral thermal conductivity powder to increase the contact surfaces of various materials, thereby increasing thermal conductivity channels, the thermal conductivity of the high thermal conductivity composite interface material prepared is up to 5.0-7.2 W/m•K.
(FR) La présente invention concerne un matériau d’interface composite à conductivité thermique élevée, comprenant un polymère d’organosilicium, une poudre à conductivité thermique et un adjuvant, la poudre à conductivité thermique comprenant une poudre à conductivité thermique sphérique et une poudre à conductivité thermique polyédrique, et le rapport en parties en poids du polymère d’organosilicium, de la poudre à conductivité thermique sphérique, de la poudre à conductivité thermique polyédrique et de l’adjuvant est comme suit : 5 à 10 du polymère d’organosilicium, 75 à 90 de la poudre à conductivité thermique sphérique, 1 à 5 de la poudre à conductivité thermique polyédrique, et 0,5 à 1 de l’adjuvant. L’invention concerne en outre un procédé de préparation d’un matériau d’interface composite à conductivité thermique élevée polyédrique. Le matériau d’interface composite à conductivité thermique élevée est préparé par mélange et calandrage d’un polymère d’organosilicium, d’une poudre à conductivité thermique et d’un adjuvant, la poudre à conductivité thermique comprenant une poudre à conductivité thermique sphérique et une poudre à conductivité thermique polyédrique. En utilisant la poudre à conductivité thermique polyédrique pour augmenter les surfaces de contact de différents matériaux, de manière à augmenter les canaux de conductivité thermique, la conductivité thermique du matériau d’interface composite à conductivité thermique élevée préparé est de jusqu’à 5,0 à 7,2 W/m • K.
(ZH) 提供了一种高导热复合界面材料,包括有机硅聚合物、导热粉体和助剂,其中所述导热粉体包括球形导热粉体和多面体导热粉体,其中,所述有机硅聚合物、球形导热粉体、多面体导热粉体和助剂的重量份配比为有机硅聚合物5-10,球形导热粉体75-90,多面体导热粉体1-5,助剂0.5-1。还提供了一种多面体高导热复合界面材料的其制备方法,通过将有机硅聚合物、导热粉体和助剂进行混合处理并压延处理,制得高导热复合界面材料,其中所述导热粉体包括球形导热粉体和多面体导热粉体。通过利用多面体导热粉体来增加各材料的接触面,从而增加导热通道,制备的高导热复合界面材料导热率高达5.0-7.2W/m·K。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)