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1. (WO2017041280) LED DEVICE HAVING TRANSITION SUBSTRATE AND ENCAPSULATION METHOD THEREFOR

Pub. No.:    WO/2017/041280    International Application No.:    PCT/CN2015/089403
Publication Date: Fri Mar 17 00:59:59 CET 2017 International Filing Date: Sat Sep 12 01:59:59 CEST 2015
IPC: H01L 33/48
Applicants: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
佛山市国星光电股份有限公司
Inventors: LI, Zongtao
李宗涛
DING, Xinrui
丁鑫锐
LI, Honghao
李宏浩
GUAN, Wohuan
关沃欢
Title: LED DEVICE HAVING TRANSITION SUBSTRATE AND ENCAPSULATION METHOD THEREFOR
Abstract:
An LED device having a transition substrate (12), comprising at least one LED unit (1), a metal substrate (2) and an encapsulation colloid. The LED unit (1) comprises one LED chip (11) and one transition substrate (12), wherein an expansion coefficient value of the transition substrate (12) is between expansion coefficients of the LED chip (11) and the metal substrate (2), and a difference value between the expansion coefficient value and the expansion coefficient of the LED chip (11) is 0-20% of the expansion coefficient of the LED chip (11); the LED chip (11) is a flip chip, and positive and negative electrodes are arranged at the bottom thereof; at least two welding layers (121), which are insulated from each other, are arranged on an upper surface of the transition substrate (12); at least two patch pins (123), which are insulated from each other, are arranged on a lower surface of the transition substrate (12); at least two welding layers (121) are electrically connected to the two patch pins (123) respectively; and the positive and negative electrodes of the LED chip (11) are respectively connected to the welding layers (121) on the transition substrate (12) so as to form the LED unit (1), and the LED unit (1) is arranged on the metal plate (2) via the patch pins (123) of the transition substrate (12). The encapsulation colloid covers and wraps the LED unit (1). The LED device is high in reliability and low in production cost, and the shape and size thereof are not limited.