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1. (WO2017040874) 3D PRINTING METHOD UTILIZING HEAT-CURABLE SILICONE COMPOSITION

Pub. No.:    WO/2017/040874    International Application No.:    PCT/US2016/050023
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Sep 03 01:59:59 CEST 2016
IPC: B29C 67/00
B33Y 80/00
B29K 83/00
C08L 83/04
B33Y 70/00
B33Y 10/00
Applicants: DOW SILICONES CORPORATION
Inventors: BACKER, Michael W.
MILROY, Zachary
SCHAUBROECK, Sara
WOLF, Hans Peter
ZHU, Bizhong
Title: 3D PRINTING METHOD UTILIZING HEAT-CURABLE SILICONE COMPOSITION
Abstract:
A method of forming a three-dimensional (3D) article comprises the steps of I) printing a first heat-curable silicone composition with a 3D printer to form a layer, II) heating the layer to form an at least partially cured layer, III) printing a second heat-curable silicone composition on the at least partially cured layer with the 3D printer to form a subsequent layer, and IV) heating the subsequent layer to form an at least partially cured subsequent layer. Optionally, steps III) and IV) can be repeated with independently selected heat-curable silicone composition(s) for any additional layer(s) to form the 3D article. The first and second heat-curable silicone compositions may be the same as or different from one another.