Search International and National Patent Collections

1. (WO2017040722) METHODS AND APPARATUS FOR IN-SITU CLEANING OF COPPER SURFACES AND DEPOSITION AND REMOVAL OF SELF-ASSEMBLED MONOLAYERS

Pub. No.:    WO/2017/040722    International Application No.:    PCT/US2016/049785
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Sep 01 01:59:59 CEST 2016
IPC: H01L 21/02
H01L 21/205
H01L 21/324
Applicants: APPLIED MATERIALS, INC.
Inventors: VISSER, Robert Jan
ARNEPALLI, Ranga Rao
GORADIA, Prerna
Title: METHODS AND APPARATUS FOR IN-SITU CLEANING OF COPPER SURFACES AND DEPOSITION AND REMOVAL OF SELF-ASSEMBLED MONOLAYERS
Abstract:
A method of processing includes: providing a substrate having a contaminant material disposed on the copper surface to a substrate support within a hot wire chemical vapor deposition (HWCVD) chamber; providing hydrogen (H2) gas to the HWCVD chamber; heating one or more filaments disposed in the HWCVD chamber to a temperature sufficient to dissociate the hydrogen (H2) gas; exposing the substrate to the dissociated hydrogen (H2) gas to remove at least some of the contaminant material from the copper surface; cooling the one or more filaments to room temperature; exposing the substrate in the HWCVD chamber to one or more chemical precursors to deposit a self-assembled monolayer atop the copper surface; and depositing a second layer atop the substrate.