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1. (WO2017040714) INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC) PACKAGE AND AN INTERPOSER WITH EMBEDDED PASSIVE COMPONENTS

Pub. No.:    WO/2017/040714    International Application No.:    PCT/US2016/049774
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Sep 01 01:59:59 CEST 2016
IPC: H01L 23/498
H01L 21/48
H01L 23/50
H01L 23/64
Applicants: QUALCOMM INCORPORATED
Inventors: LI, Yue
PAYNTER, Charles David
LANE, Ryan David
ZANG, Ruey Kae
Title: INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC) PACKAGE AND AN INTERPOSER WITH EMBEDDED PASSIVE COMPONENTS
Abstract:
An integrated circuit (IC) module that includes an integrated circuit (IC) package, a plurality of first solder interconnects coupled to the IC package, an interposer coupled to the IC package through the plurality of first solder interconnects, a plurality of second solder interconnects coupled to the interposer; and a printed circuit board (PCB) coupled to the interposer through the plurality of second solder interconnects. The interposer includes an encapsulation layer, a first passive component at least partially embedded in the encapsulation layer, and a plurality of interconnects coupled to the first passive component. The encapsulation layer includes a mold and/or an epoxy fill. The first passive component is configured to operate as an electronic voltage regulator (EVR) for the IC module. In some implementations, the interposer is a fan out interposer.