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1. (WO2017040571) METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE

Pub. No.:    WO/2017/040571    International Application No.:    PCT/US2016/049563
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Sep 01 01:59:59 CEST 2016
IPC: C09G 1/02
C09K 3/14
H01L 21/306
H01L 21/321
Applicants: CABOT MICROELECTRONICS CORPORATION
Inventors: CUI, Ji
LAM, Viet
GRUMBINE, Steven
Title: METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
Abstract:
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.