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1. (WO2017040482) FIDUCIAL MARK FOR CHIP BONDING

Pub. No.:    WO/2017/040482    International Application No.:    PCT/US2016/049413
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Wed Aug 31 01:59:59 CEST 2016
IPC: H05K 1/02
H05K 1/18
H01L 23/00
H01L 33/48
H05K 3/32
H05K 3/34
H05K 1/11
Applicants: 3M INNOVATIVE PROPERTIES COMPANY
Inventors: FOO, Siang Sin
KOSUGI, Hiromitsu
NARAG, Alejandro Aldrin II A.
PALANISWAMY, Ravi
Title: FIDUCIAL MARK FOR CHIP BONDING
Abstract:
A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.