Search International and National Patent Collections
|1. (WO2017040482) FIDUCIAL MARK FOR CHIP BONDING|
|Applicants:||3M INNOVATIVE PROPERTIES COMPANY
|Inventors:||FOO, Siang Sin
NARAG, Alejandro Aldrin II A.
|Title:||FIDUCIAL MARK FOR CHIP BONDING|
A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.