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1. (WO2017040302) IMPLANT DEVICE AND METHOD OF MAKING THE SAME
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Pub. No.: WO/2017/040302 International Application No.: PCT/US2016/049034
Publication Date: 09.03.2017 International Filing Date: 26.08.2016
IPC:
A61F 2/14 (2006.01)
A HUMAN NECESSITIES
61
MEDICAL OR VETERINARY SCIENCE; HYGIENE
F
FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, E.G. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
2
Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
02
Prostheses implantable into the body
14
Eye parts, e.g. lenses, corneal implants; Artificial eyes
Applicants:
CALIFORNIA INSTITUTE OF TECHNOLOGY [US/US]; Office of Technology Transfer 1200 E. California Blvd., M/C 6-32 Pasadena, California 91125, US
Inventors:
TAI, Yu-Chong; US
CHANG, Han-Chieh; US
Agent:
SNYDER, Joseph R.; US
MATHISON, Mark P.; US
HAO, Joe C.; US
Priority Data:
14/838,78828.08.2015US
Title (EN) IMPLANT DEVICE AND METHOD OF MAKING THE SAME
(FR) DISPOSITIF D’IMPLANT ET SON PROCÉDÉ DE FABRICATION
Abstract:
(EN) The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.
(FR) L'invention concerne la mise sous boîtier de puce et des procédés d'assemblage de dispositifs de prothèse rétinienne. De manière avantageuse, un adhésif ou une résine époxy photo-structurable telle qu'un photorésine est utilisé comme colle pour fixer une puce sur le substrat à film mince ciblé (par exemple, en parylène) de sorte que la puce est utilisée en tant qu’élément supplémentaire pour empêcher le délaminage.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)