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1. (WO2017040239) PACKAGE PROGRAMMABLE DECOUPLING CAPACITOR ARRAY

Pub. No.:    WO/2017/040239    International Application No.:    PCT/US2016/048857
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Aug 27 01:59:59 CEST 2016
IPC: H01L 23/522
H01L 23/50
Applicants: APPLIED MICRO CIRCUITS CORPORATION
Inventors: THAIK, Rich
YEUNG, Alfred
LAMBERT, April
PLUNKETT, Jeremy
Title: PACKAGE PROGRAMMABLE DECOUPLING CAPACITOR ARRAY
Abstract:
A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.