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1. (WO2017039977) THERMAL MANAGEMENT OF ELECTRONIC HEADSETS

Pub. No.:    WO/2017/039977    International Application No.:    PCT/US2016/046130
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Wed Aug 10 01:59:59 CEST 2016
IPC: G06F 3/01
G06F 1/20
G06F 1/16
Applicants: QUALCOMM INCORPORATED
Inventors: RAHIM, Emil
SAEIDI, Mehdi
MITTAL, Arpit
MITTAL, Rajat
Title: THERMAL MANAGEMENT OF ELECTRONIC HEADSETS
Abstract:
Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.