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1. (WO2017039953) RESINS FOR USE AS TIE LAYER IN MULTILAYER STRUCTURE AND MULTILAYER STRUCTURES COMPRISING THE SAME

Pub. No.:    WO/2017/039953    International Application No.:    PCT/US2016/045798
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Aug 06 01:59:59 CEST 2016
IPC: C08L 23/06
C08L 51/06
C08L 23/08
C08K 5/42
B32B 27/32
Applicants: DOW GLOBAL TECHNOLOGIES LLC
Inventors: ZHENG, Yong
WALTHER, Brian W.
BAWISKAR, Santosh S.
SERRAT, Cristina
Title: RESINS FOR USE AS TIE LAYER IN MULTILAYER STRUCTURE AND MULTILAYER STRUCTURES COMPRISING THE SAME
Abstract:
The present invention provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure that comprises a high density polyethylene having a density greater than 0.960 g/cm3, wherein the high density polyethylene comprises 1 to 99 weight percent of the resin, a maleic anhydride grafted high density polyethylene, wherein the maleic anhydride grafted high density polyethylene comprises 1 to 99 weight percent of the resin, and a catalyst comprising at least one Lewis acid.