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1. (WO2017039918) BALL GRID ARRAY (BGA) APPARATUS AND METHODS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/039918 International Application No.: PCT/US2016/045164
Publication Date: 09.03.2017 International Filing Date: 02.08.2016
IPC:
H01L 23/498 (2006.01) ,H01L 23/00 (2006.01)
[IPC code unknown for H01L 23/498][IPC code unknown for H01L 23]
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
SOOD, Mohit; US
LIU, Boxi; US
TAN, Wei; US
XU, Huili; US
MIRPURI, Kabir J.; US
Agent:
MOORE, Michael S.; US
AUYEUNG, Al; US
BLAIR, Steven R.; US
COFIELD, Michael A.; US
COWGER, Graciela G.; US
DANSKIN, Timothy A.; US
FORD, Stephen S.; US
GARTHWAITE, Martin S.; US
LEE, Katherine D.; US
MAKI, Nathan R.; US
MARLINK, Jeffrey S.; US
MEININGER, Mark M.; US
PARKER, Wesley E.; US
RASKIN, Vladimir; US
STRAUSS, Ryan N.; US
WANG, Yuke; US
Priority Data:
14/846,48904.09.2015US
Title (EN) BALL GRID ARRAY (BGA) APPARATUS AND METHODS
(FR) APPAREIL À BOÎTIER MATRICIEL À BILLES (BGA) ET PROCÉDÉS
Abstract:
(EN) Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.
(FR) Selon des modes de réalisation, l'invention peut se rapporter à un appareil doté d'un boîtier matriciel à billes (BGA) qui comprend une pluralité de billes de brasure d'un matériau hors eutectique. Selon des modes de réalisation, les billes de soudure respectives de la pluralité de billes de soudure peuvent former des joints à soudure tendre entre un substrat du BGA et un second substrat. Selon certains modes de réalisation, les joints peuvent être à moins d'approximativement 0,6 micromètre les uns des autres. D'autres modes de réalisation peuvent être décrits et/ou revendiqués.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)