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1. (WO2017039887) SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE LINES AND METHODS OF FORMING THE SEMICONDUCTOR DEVICES

Pub. No.:    WO/2017/039887    International Application No.:    PCT/US2016/044246
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Jul 28 01:59:59 CEST 2016
IPC: H01L 21/768
H01L 21/02
H01L 21/027
Applicants: MICRON TECHNOLOGY, INC.
Inventors: BROWN, William R.
RUSSON, Jenna L.
BOSSART, Tim H.
WATSON, Brian R.
MIRIN, Nikolay A.
KEWLEY, David A.
Title: SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE LINES AND METHODS OF FORMING THE SEMICONDUCTOR DEVICES
Abstract:
A semiconductor device including conductive lines is disclosed. First conductive lines each comprise a first portion, a second portion, and an enlarged portion, the enlarged portion connecting the first portion and the second portion of the first conductive line. The semiconductor device includes second conductive lines, at least some of the second conductive lines disposed between a pair of the first conductive lines, each second conductive line including a larger cross-sectional area at an end portion of the second conductive line than at other portions thereof. The semiconductor device includes a pad on each of the first conductive lines and the second conductive lines, wherein the pad on each of the second conductive lines is on the end portion thereof and the pad on the each of the first conductive lines is on the enlarged portion thereof.